XC6SLX100T-N3FGG676C

The XC6SLX100T-N3FGG676C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD. This commercial-grade, surface-mount FPGA integrates 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and up to 376 I/O in a 676-ball BGA (676-FBGA, 27×27) package.

Designed for commercial electronic designs, the device operates from a 1.14 V to 1.26 V supply and is rated for an operating temperature range of 0 °C to 85 °C. RoHS-compliant construction supports regulatory requirements for many product lines.

Key Features

• Logic Capacity — 101,261 logic elements provide significant programmable logic resources for implementing complex digital functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM for data buffering, state storage, and intermediate processing.
• I/O Resources — 376 general-purpose I/O pins to support wide bus interfaces, parallel peripherals, and external device connectivity.
• Package — 676-ball BGA (676-FBGA, 27×27) surface-mount package for compact, high-density board designs.
• Power — Operating supply voltage range of 1.14 V to 1.26 V to match system power domains.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C suitable for general-purpose electronic products.
• Compliance — RoHS-compliant construction.

Typical Applications

• High-density I/O systems — Use the 376 I/O pins to interface with wide parallel buses, sensors, or multiple peripherals.
• Memory-intensive embedded logic — Approximately 4.94 Mbits of on-chip RAM supports local buffering, FIFOs, and temporary data storage.
• Custom digital logic and prototyping — 101,261 logic elements enable implementation of complex custom logic blocks and system prototypes.
• Commercial electronic products — Commercial-grade rating and surface-mount BGA package align with mainstream product development and manufacturing processes.

Unique Advantages

• Substantial logic capacity: 101,261 logic elements give designers room to implement complex state machines, signal processing, and glue logic without immediate upsizing.
• On-chip memory availability: Approximately 4.94 Mbits of embedded RAM reduces external memory dependency and simplifies board-level designs.
• High I/O count: 376 I/O pins accommodate extensive peripheral connections, multi-channel interfaces, and wide data paths.
• Compact, manufacturable package: 676-FBGA (27×27) surface-mount package provides a high-density footprint suitable for modern PCB layouts.
• Controlled power domain: Narrow supply range (1.14 V–1.26 V) enables integration into systems with defined low-voltage rails.
• Regulatory alignment: RoHS-compliant construction supports environmental and regulatory requirements for commercial products.

Why Choose XC6SLX100T-N3FGG676C?

The XC6SLX100T-N3FGG676C positions itself as a thoughtfully balanced Spartan-6 LXT FPGA option for commercial designs that require a combination of considerable logic resources, embedded memory, and extensive I/O in a compact BGA package. Its electrical and thermal ratings support mainstream electronic product development and manufacturing flows.

Backed by AMD, this device is suitable for designers seeking scalable, reconfigurable logic capacity with on-chip memory and a high pin count for system-level integration. The combination of features offers long-term value for projects that prioritize integration density and predictable operating conditions.

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