XC6SLX100T-N3FG676C

The XC6SLX100T-N3FG676C is a Spartan-6 LXT Field Programmable Gate Array (FPGA) IC from AMD provided in a 676-BGA package. It delivers 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 376 general-purpose I/O pins, all in a surface-mount 676-FBGA (27×27) package.

Rated for commercial-grade operation (0 °C to 85 °C) and RoHS-compliant, this device is designed for commercial electronic designs requiring a large logic resource count and on-chip memory within a compact BGA footprint. The device operates from a core supply range of 1.14 V to 1.26 V.

Key Features

• Core Logic  Provides 101,261 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support data buffering, state machines, and small memory-intensive functions without external RAM.
• I/O Capacity  376 I/O pins available to interface with multiple peripherals, sensors, and system buses on a single device.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package & Mounting  676-FBGA (27×27) surface-mount package providing a high-density solution for space-constrained PCBs.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• Substantial Logic Capacity: 101,261 logic elements allow implementation of sizable custom logic and parallel processing tasks on a single FPGA.
• On-Chip Memory Resources: Approximately 4.94 Mbits of embedded RAM reduce the need for external memory for many control and buffering functions.
• High I/O Count: 376 I/Os enable integration of multiple interfaces and peripherals without additional multiplexing hardware.
• Compact, High-Density Package: 676-FBGA (27×27) delivers a compact footprint for dense board designs while preserving routing resources.
• Commercial Temperature Rating: Specified 0 °C to 85 °C supports standard commercial deployments and manufacturing flows.
• RoHS Compliance: Meets common environmental regulations for lead-free assembly.

Why Choose XC6SLX100T-N3FG676C?

The XC6SLX100T-N3FG676C combines a large logic element count, substantial on-chip memory, and a high I/O complement in a compact 676-FBGA package, offering a balanced solution for commercial designs that require significant programmable logic and local memory. Its low-voltage core operation and RoHS compliance make it suitable for modern board assemblies where power and regulatory conformity matter.

This device is well suited to designers and procurement teams seeking to consolidate logic and memory onto a single FPGA in space-constrained, commercial-temperature applications while retaining flexibility for a range of digital functions.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC6SLX100T-N3FG676C. Our team can provide lead-time information and assist with volume requirements.