XC6SLX100T-N3CSG484C

The XC6SLX100T-N3CSG484C is a Spartan®-6 LXT field programmable gate array from AMD, supplied in a 484-pin CSPBGA (19×19) package for surface-mount assembly. It delivers substantial logic capacity, embedded memory, and a high I/O count in a compact commercial-grade package suitable for a wide range of embedded logic applications.

With approximately 101,261 logic elements, about 4.94 Mbits of on-chip RAM, and 296 I/O, this device addresses designs that require significant integration of programmable logic and memory while operating at a low core voltage range.

Key Features

• Core Logic Approximately 101,261 logic elements provide the programmable fabric for custom digital functions and complex state machines.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM (4,939,776 total RAM bits) for buffers, FIFOs, and on-chip data storage.
• I/O Capacity 296 general-purpose I/O pins to support multiple interfaces, parallel buses, and GPIO requirements.
• Power Core voltage operating range from 1.14 V to 1.26 V to match system power rails and enable predictable power planning.
• Package & Mounting 484‑FBGA / 484‑CSPBGA (19×19) package in a surface-mount form factor for compact PCB integration.
• Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• RoHS Compliance Device is RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Embedded Logic Integration – Implement custom digital processing, control logic, and glue-logic functions where significant programmable resources are required.
• Interface and Protocol Bridging – Use the device’s abundant I/O and on-chip memory to bridge between parallel and serial interfaces or to implement protocol converters.
• Prototyping and Development – Provide a platform for developing and validating complex logic designs that leverage high logic density and embedded RAM.
• System I/O Expansion – Add programmable I/O handling and signal conditioning for systems needing additional GPIO and interface flexibility.

Unique Advantages

• High Logic Density: Approximately 101,261 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant On-Chip Memory: Nearly 4.94 Mbits of embedded RAM support buffering, packet staging, and temporary data storage without external memory.
• Ample I/O Resources: 296 I/O pins give designers flexibility to implement multiple parallel interfaces or mixed-signal front ends.
• Compact, Surface-Mount Package: 484‑CSPBGA (19×19) package minimizes PCB footprint while supporting high pin counts for dense designs.
• Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern system power domains for efficient power integration.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose XC6SLX100T-N3CSG484C?

The XC6SLX100T-N3CSG484C offers a balance of large logic capacity, embedded memory, and abundant I/O in a compact 484‑CSPBGA package, making it well suited for embedded systems and OEM applications that require integration of multiple digital functions on a single device. Its commercial temperature rating and RoHS compliance simplify adoption into standard production environments.

This Spartan‑6 LXT device is appropriate for designers who need predictable power characteristics (1.14 V–1.26 V core) and a high-density programmable platform for prototyping, interface bridging, and on-board logic consolidation.

Request a quote or submit an inquiry to check availability, pricing, and lead times for XC6SLX100T-N3CSG484C. Our team can provide the procurement details you need to move your design forward.