XC6SLX100T-4FGG676C

The XC6SLX100T-4FGG676C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD. It provides on-chip programmable logic and routing resources in a commercial-grade, surface-mount 676-ball BGA package.

With a large logic capacity, significant embedded RAM, and a high I/O count, this device targets designs that require substantial on-chip logic, memory, and external interface density while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity 101,261 logic elements to implement complex digital logic and control functions.
• Configurable Logic Blocks 7,911 CLBs/LABs of programmable fabric for parallel logic and state-machine implementations.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• I/O Count 376 user I/O pins to support multiple external interfaces and high-density connections.
• Package & Mounting 676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount format for compact board integration.
• Power Specified voltage supply range of 1.14 V to 1.26 V for core operation.
• Temperature & Grade Commercial-grade device rated for operation from 0°C to 85°C.
• Environment RoHS compliant.

Typical Applications

• High-density I/O systems — With 376 I/O pins, well suited for designs that require many external interfaces and parallel signal routing.
• Embedded logic and control — 101,261 logic elements support complex control, state machines, and custom digital logic implementations.
• On-chip buffering and storage — Approximately 4.94 Mbits of embedded RAM for FIFOs, frame buffers, and temporary data storage close to the logic.

Unique Advantages

• High logic density: 101,261 logic elements provide capacity for sophisticated digital designs without external logic expansion.
• Substantial on-chip memory: Approximately 4.94 Mbits of RAM reduces dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O availability: 376 I/O pins enable support for multiple peripherals and interfaces directly from the device.
• Compact BGA footprint: 676-BGA (27×27) package allows dense PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: Specified 0°C to 85°C operation suitable for standard commercial deployments.
• RoHS compliant: Conforms to environmental lead-free requirements for modern electronics production.

Why Choose XC6SLX100T-4FGG676C?

The XC6SLX100T-4FGG676C combines a large logic fabric, substantial embedded memory, and a high I/O count within a compact 676-BGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronic products that require on-chip programmability and dense external connectivity.

This device is a fit for engineering teams building medium- to large-scale digital logic, control, and interface solutions that benefit from integrated memory and extensive I/O without moving to external logic or memory components. The specification set supports scalability and integration in production designs.

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