XC6SLX100T-3FGG900C

The XC6SLX100T-3FGG900C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD. It provides a programmable logic fabric with substantial embedded memory and a high pin count in a compact BGA package for surface-mount assemblies.

With approximately 101,261 logic elements, roughly 4.94 Mbits of embedded RAM, 498 user I/O pins, a 900-ball BGA package, a 1.14 V–1.26 V supply window, and a commercial operating range of 0 °C to 85 °C, this device targets designs that require dense logic, on-chip memory, and significant I/O integration.

Key Features

• Core Logic Approximately 101,261 logic elements to implement complex custom digital logic and state machines.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing without external memory.
• I/O Density 498 user I/O pins to support wide parallel interfaces, multiple peripherals, and high pin-count connectivity.
• Power Core voltage supply range of 1.14 V to 1.26 V for the device core power domain.
• Package & Mounting 900-ball BGA package (Supplier device package: 900-FBGA, 31×31) in a surface-mount format suitable for compact board layouts.
• Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction for regulatory alignment in applicable assemblies.

Typical Applications

• Custom digital logic and prototyping — Implement state machines, glue logic, and custom datapaths using the available logic elements and embedded RAM.
• Embedded systems — Use on-chip memory and logic capacity to integrate control, data buffering, and interface functions within a single device.
• High-density I/O interfacing — Leverage 498 user I/O pins for parallel buses, multiplexed sensor networks, or multiple peripheral connections.

Unique Advantages

• Large on-chip logic capacity: Approximately 101,261 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 4.94 Mbits of RAM supports buffering and intermediate data storage without immediate need for external memory.
• High pin count: 498 I/O pins provide flexibility for parallel interfaces and dense connectivity options on modern PCBs.
• Compact BGA package: 900-ball BGA (31×31) minimizes footprint while delivering high I/O density for space-constrained designs.
• Commercial temperature and RoHS compliance: Clear operating range (0 °C to 85 °C) and RoHS status simplify qualification for mainstream electronic products.
• Low-voltage core operation: Narrow core supply window (1.14 V–1.26 V) aligns with common FPGA core power rails in contemporary designs.

Why Choose XC6SLX100T-3FGG900C?

The XC6SLX100T-3FGG900C offers a balanced combination of logic capacity, embedded memory, and I/O density in a surface-mount 900-ball BGA package, making it suitable for designs that need to consolidate multiple digital functions on a single device. Its commercial-grade temperature range and RoHS compliance align with standard electronic product requirements.

Engineers and procurement teams seeking a Spartan®-6 LXT FPGA from AMD will find this part appropriate for projects that require substantial on-chip resources, compact packaging, and predictable supply voltage and temperature characteristics. Documentation from the manufacturer is available to support design and integration.

Request a quote or submit an inquiry for XC6SLX100T-3FGG900C to receive pricing and availability information for your project needs.