XC6SLX100T-3FGG900I

The XC6SLX100T-3FGG900I is a Spartan‑6 LXT field programmable gate array (FPGA) manufactured by AMD. It provides a balance of logic capacity, embedded memory, and high I/O count in a 900‑ball BGA package targeted for industrial applications.

With 101,261 logic elements, approximately 4.94 Mbits of on‑chip RAM and 498 user I/Os, this device is suited for designs that require substantial programmable logic and dense connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity — 7,911 CLBs and 101,261 logic elements for implementing complex digital logic and custom processing functions.
• Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM to support data buffering, FIFOs and scratchpad storage for logic functions.
• I/O Resources — 498 user I/Os to support wide parallel interfaces and high‑density connections to peripherals and external devices.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting — 900‑BBGA package (supplier device package: 900‑FBGA, 31 × 31 mm) designed for surface‑mount assembly.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant, meeting common environmental requirements for lead‑free assembly.

Typical Applications

• Custom Logic and Prototyping — Implement complex state machines, data paths and custom processing using the device's 101,261 logic elements and 7,911 CLBs.
• Industrial Control — Use the industrial temperature rating and abundant I/O to support motor control, PLC interfaces and real‑time control functions.
• High‑Density I/O Systems — Leverage 498 I/Os for parallel sensor arrays, wide buses or multi‑lane peripheral interfaces requiring extensive pin count.
• On‑board Data Buffering — Utilize approximately 4.94 Mbits of embedded RAM for packet buffering, temporary storage or FIFO implementations.

Unique Advantages

• High Logic Density: 101,261 logic elements enable implementation of sizeable custom logic blocks and parallel processing architectures.
• Substantial Embedded Memory: Approximately 4.94 Mbits of on‑chip RAM reduces reliance on external memory for intermediate data storage.
• Extensive I/O Count: 498 user I/Os simplify board routing for multi‑channel and multi‑interface designs, lowering the need for external multiplexing.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the thermal requirements of many industrial deployments.
• Compact BGA Packaging: 900‑BBGA (31 × 31 mm) package provides a compact footprint while supporting high pin count for dense system integration.
• RoHS Compliant: Meets lead‑free assembly requirements for environmentally conscious manufacturing processes.

Why Choose XC6SLX100T-3FGG900I?

The XC6SLX100T-3FGG900I offers a robust combination of logic density, embedded memory and a high I/O count in a surface‑mount 900‑ball BGA package, making it suitable for industrial designs that demand programmable flexibility and dense connectivity. Its specified core voltage range and industrial temperature rating support reliable operation across a variety of system environments.

Manufactured by AMD, this Spartan‑6 LXT device is positioned for engineers and procurement teams seeking an FPGA with substantial on‑chip resources and a compact package for scalable, long‑lifecycle designs.

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