XC6SLX100T-3FGG676C

The XC6SLX100T-3FGG676C is a Spartan®-6 LXT field programmable gate array (FPGA) IC designed for applications that require substantial programmable logic capacity and on-chip memory. It combines a large logic fabric, significant embedded RAM, and a high I/O count in a 676-ball FBGA package for surface-mount assembly.

This commercial-grade device is suited to designs that need substantial logic resources, flexible I/O interfacing, and integrated memory, while operating within a standard commercial temperature range and low-voltage core supply.

Key Features

• Core Logic  Provides 101,261 logic elements for implementing complex custom logic, state machines, and hardware accelerators.
• Programmable Logic Blocks  Includes 7,911 logic blocks to organize and map user designs across the FPGA fabric.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density  376 user I/O pins to support high-pin-count interfaces, multiple buses, and parallel connectivity options.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling integration into low-voltage system domains.
• Package & Mounting  676-ball FBGA (27 × 27 mm) package in a 676-BGA footprint, designed for surface-mount assembly on modern PCBs.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C, suitable for standard commercial electronic environments.
• Environmental Compliance  RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Typical Applications

• High-density logic implementations  Use the large logic element count for custom hardware acceleration, protocol processing, or complex state machines.
• I/O-intensive interfaces  376 I/O pins allow the FPGA to act as a hub for multiple parallel interfaces, bridging, or multi-channel data acquisition.
• On-chip buffering and data handling  Approximately 4.94 Mbits of embedded RAM support local buffering, FIFOs, and temporary storage for streaming or packetized data.

Unique Advantages

• High logic capacity: 101,261 logic elements enable implementation of complex custom logic without immediate recourse to external processors.
• Significant embedded memory: Nearly 5 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Large I/O complement: 376 I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing the need for external multiplexers or expanders.
• Compact, assembly-ready package: 676-FBGA (27 × 27) surface-mount package supports high-density board layouts while delivering the device’s logic and I/O capacity.
• Low-voltage core operation: Core supply range of 1.14 V to 1.26 V aligns with low-voltage system domains, aiding power budgeting and design consistency.
• RoHS compliant: Environmentally compliant construction helps meet regulatory and customer requirements for lead-free assembly.

Why Choose XC6SLX100T-3FGG676C?

The XC6SLX100T-3FGG676C positions itself as a commercial-grade FPGA offering a balance of substantial logic resources, plentiful on-chip RAM, and extensive I/O in a compact 676-FBGA package. It is well-suited for designers who require programmable logic density and embedded memory in applications operating within standard commercial temperature ranges.

This device delivers a scalable platform for mid- to high-complexity designs, enabling integration of custom logic, protocol handling, and local data buffering while maintaining RoHS compliance and surface-mount packaging appropriate for modern PCB assembly processes.

Request a quote or submit an inquiry to obtain pricing, availability, and integration support for the XC6SLX100T-3FGG676C. Our team will respond with a tailored quote and product availability details.