XC6SLX100T-3FGG484C

The XC6SLX100T-3FGG484C is a Spartan®-6 LXT FPGA from AMD, delivered in a 484-ball BGA package. It provides a high-capacity programmable logic fabric with on-chip memory and a substantial user I/O count for compact, surface-mount system designs.

Key characteristics include 101,261 logic elements, approximately 4.94 Mbits of embedded memory, 296 user I/Os, and operation from a 1.14 V to 1.26 V core supply at commercial temperature range (0 °C to 85 °C). The device is RoHS compliant.

Key Features

• Logic Capacity  101,261 logic elements provide significant programmable fabric for implementing complex digital logic and custom datapaths.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources  296 user I/Os enable broad external connectivity and signal interfacing in a single device.
• Power  Core voltage supply range of 1.14 V to 1.26 V supports the device’s low-voltage FPGA core requirements.
• Package & Mounting  484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for dense board integration.
• Temperature & Grade  Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Unique Advantages

• High programmable density: 101,261 logic elements deliver extensive on-chip resources to consolidate multiple functions into a single FPGA.
• Generous embedded memory: Approximately 4.94 Mbits of RAM reduces dependence on external memory for many data buffering and local storage tasks.
• Extensive I/O capability: 296 I/Os enable flexible interfacing across many signals without additional I/O expanders.
• Compact BGA footprint: 484-ball (23×23) BGA package supports space-constrained PCB layouts while maintaining a robust pin count.
• Commercial temperature suitability: Rated 0 °C to 85 °C for designs targeting commercial-environment applications.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC6SLX100T-3FGG484C?

The XC6SLX100T-3FGG484C combines a large logic element count, substantial embedded RAM, and a high I/O count in a compact 484-ball BGA surface-mount package, making it well suited for designs that require consolidated digital processing in a space-efficient form factor. Supplied by AMD, the device is specified for commercial temperature operation and RoHS-compliant production.

This FPGA is appropriate for projects that need significant programmable resources, on-chip memory, and plentiful I/O while operating within a 1.14 V to 1.26 V core supply range. Its combination of capacity and packaging supports scalable designs where component consolidation and board density matter.

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