XC6SLX100T-3CSG484I

The XC6SLX100T-3CSG484I is a Spartan®-6 LXT field programmable gate array (FPGA) IC designed for industrial applications. It delivers a large programmable fabric with substantial on-chip memory and a high I/O count in a compact 484-CSPBGA package, enabling integration of complex logic, I/O interfacing, and embedded functions into a single device.

With an operating temperature range of −40 °C to 100 °C and RoHS compliance, this device is targeted at industrial designs that require robust operation and high integration density while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Programmable Logic 101,261 logic elements provide a large programmable fabric for implementing custom logic, control, and signal processing functions.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM supports buffering, state storage, and small memory-intensive functions without external memory.
• I/O Resources Up to 296 user I/O pins enable extensive peripheral and bus interfacing for mixed-signal, sensor, and communication front-ends.
• Package 484-CSPBGA (19 × 19 mm) package provides a high-density, surface-mount footprint suitable for space-constrained boards.
• Power Core voltage supply range of 1.14 V to 1.26 V for integration with modern power-rail architectures.
• Industrial Operating Range Rated for −40 °C to 100 °C operation to meet temperature demands of industrial environments.
• Regulatory RoHS compliant for reduced hazardous substances in manufacturing and assembly.

Typical Applications

• Industrial Control Systems — Use the device’s large logic capacity and industrial temperature rating for control, sequencing, and custom I/O aggregation in factory automation and process control equipment.
• Embedded Processing and Prototyping — Implement custom accelerators, glue logic, and prototype systems where significant on-chip logic and memory reduce reliance on external components.
• Communication Interfaces — Leverage the high I/O count to implement multi-channel interfaces, bridge logic, and protocol converters in communication or instrumentation equipment.

Unique Advantages

• High Logic Density: 101,261 logic elements permit integration of complex functions and multiple subsystems into a single FPGA, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM supports buffering and local data storage, lowering the need for external memory devices.
• Extensive I/O Capability: 296 I/O pins provide flexibility for connecting sensors, buses, and peripherals without additional multiplexing logic.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for deployment in demanding environments where temperature resilience is required.
• Compact, High-Density Package: The 484-CSPBGA (19 × 19 mm) package enables high integration on space-constrained PCBs while supporting surface-mount assembly.
• RoHS Compliant: Meets regulatory requirements for hazardous substance reduction in manufacturing processes.

Why Choose XC6SLX100T-3CSG484I?

The XC6SLX100T-3CSG484I combines a large programmable fabric, substantial embedded memory, and a high I/O count in a compact industrial-grade package, making it well suited for engineers designing complex embedded and industrial systems. Its operating temperature range and RoHS compliance support long-term, production-ready deployments where environmental resilience and regulatory adherence matter.

This device is a solid choice for development teams seeking to consolidate logic, memory, and I/O functionality into a single FPGA solution—reducing bill of materials, simplifying board design, and enabling scalable implementations backed by a known FPGA product family.

Request a quote or submit a purchasing inquiry to receive pricing and availability for the XC6SLX100T-3CSG484I and to discuss how this FPGA can meet your project requirements.