XC6SLX100T-3FG484I

The XC6SLX100T-3FG484I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 484-ball BBGA package for surface-mount assembly. It provides a large logic capacity and on-chip memory, targeting industrial and embedded designs that require programmable digital logic and flexible I/O.

Key attributes include approximately 101,261 logic elements, roughly 4.94 Mbits of embedded RAM, 296 user I/O, and an industrial operating temperature range, delivering a compact, RoHS-compliant FPGA solution for system integration and custom digital processing.

Key Features

• Core Logic  Approximately 101,261 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
• I/O Capability  296 user I/O pins to connect multiple peripherals, interfaces, and external devices directly to the FPGA fabric.
• Package & Mounting  484-BBGA (supplier package 484-FBGA, 23×23) in a surface-mount format for compact board integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match common FPGA power rails and system power architectures.
• Temperature and Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for use in demanding environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing regulations.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and abundant I/O make it suitable for control logic, protocol bridging, and real-time process interfaces.
• Embedded Systems and Prototyping  Large logic element count and on-chip memory enable custom processors, accelerators, and system integration in embedded platforms.
• Communications and Networking  Ample logic resources and I/O allow implementation of protocol handling, packet processing, and interface adaptation functions.

Unique Advantages

• High Logic Capacity: Approximately 101,261 logic elements provide the resources needed for sizeable custom logic designs.
• Substantial On-Chip Memory: Around 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-processing tasks.
• Extensive I/O Connectivity: 296 user I/O pins support multiple peripheral connections and flexible board-level interfacing.
• Industrial Temperature Rating: Operation from -40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact Surface-Mount Package: 484-BBGA (23×23) footprint enables dense, space-efficient PCB layouts.
• Regulatory Readiness: RoHS compliance simplifies adoption into assemblies requiring environmental conformance.

Why Choose XC6SLX100T-3FG484I?

The XC6SLX100T-3FG484I balances significant logic capacity, embedded memory, and extensive I/O in a compact 484-BBGA surface-mount package, making it well suited for industrial and embedded applications that require programmable, board-level digital solutions. Its industrial temperature rating and RoHS compliance offer practical reliability and manufacturability for demanding deployments.

This device is a fit for designers and engineers building custom digital control, protocol processing, and system-integration solutions who need scalable logic resources and on-chip memory within a compact package and industrial operating range.

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