XC6SLX100T-3FGG484I

The XC6SLX100T-3FGG484I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD offered in a 484-ball BGA package. It provides a high count of logic elements, significant on-chip RAM, and a large number of I/O pins in a compact surface-mount package, targeted at industrial applications requiring configurable digital logic.

With a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, this device is designed to support robust embedded designs that demand reconfigurable hardware and reliable operation across extended temperature ranges.

Key Features

• Logic Capacity — 101,261 logic elements deliver ample programmable resources for implementing complex custom logic, state machines, and control functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM provides storage for buffering, lookup tables, and local data structures without external memory.
• I/O Density — 296 I/O pins enable extensive connectivity for interfacing with sensors, peripherals, and system buses.
• Power — Supported supply voltage range of 1.14 V to 1.26 V for core operation.
• Package and Mounting — 484-ball BBGA package (supplier device package: 484-FBGA 23×23) in a surface-mount form factor for compact board integration.
• Temperature Range — Industrial operating range from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device's 101,261 logic elements and 296 I/Os to implement programmable control, I/O aggregation, and custom timing logic within industrial equipment operating across -40 °C to 100 °C.
• Data Buffering and Packet Processing — Approximately 4.94 Mbits of embedded RAM and high I/O count support on-chip buffering and packet handling in communication or data-acquisition modules.
• Custom Interface Bridging — Implement protocol conversion or glue logic between subsystems using the device's programmable logic capacity and numerous I/Os in a compact surface-mount package.

Unique Advantages

• High Logic Integration: 101,261 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count and PCB complexity.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for intermediate data storage and buffering.
• Extensive I/O Connectivity: 296 I/Os provide flexibility to interface with a wide variety of peripherals and sensors directly from the FPGA.
• Industrial Temperature Capability: Rated for -40 °C to 100 °C operation, supporting deployments in harsh or temperature-variable environments.
• Compact Surface-Mount Solution: 484-BBGA / 484-FBGA (23×23) packaging enables high-density board designs while maintaining robust soldered connections.
• RoHS Compliance: Meets RoHS requirements for lead-free manufacturing processes.

Why Choose XC6SLX100T-3FGG484I?

The XC6SLX100T-3FGG484I positions itself as a flexible, industrial-grade FPGA option that combines a large programmable fabric with significant embedded memory and a high I/O count in a compact BGA package. Its specified supply voltage range and extended operating temperature make it suitable for embedded designs that require reliable, reconfigurable hardware across varied environments.

Designers and procurement teams seeking a single-chip programmable solution to reduce BOM complexity, implement custom interfaces, or consolidate digital functions will find the XC6SLX100T-3FGG484I aligned with those goals while benefiting from RoHS compliance and surface-mount packaging for modern production workflows.

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