XC6SLX100T-3CSG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 101261 484-FBGA, CSPBGA |
|---|---|
| Quantity | 1,139 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7911 | Number of Logic Elements/Cells | 101261 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX100T-3CSG484C – Spartan®-6 LXT FPGA, 484‑CSPBGA
The XC6SLX100T-3CSG484C is a Spartan®-6 LXT field programmable gate array (FPGA) in a 484‑CSPBGA (19×19) package. It delivers a large logic capacity and on-chip memory in a surface-mount, commercial‑grade footprint suitable for programmable-logic designs that require substantial logic resources, embedded RAM, and numerous I/O signals.
Key technical attributes include 101,261 logic elements, approximately 4.94 Mbits of embedded memory, 296 I/O pins, low-voltage supply operation from 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity — 101,261 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
- I/O Density — 296 general-purpose I/O pins to support wide bus interfaces and multiple peripheral connections.
- Power — Voltage supply range from 1.14 V to 1.26 V to match low‑voltage system rails.
- Package and Mounting — 484‑CSPBGA (19×19) / 484‑FBGA package in a surface‑mount form factor for compact board designs.
- Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant for regulatory and manufacturing alignment.
Unique Advantages
- High logic density: 101,261 logic elements enable implementation of sophisticated designs without external logic expansion.
- Significant on‑chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Extensive I/O capability: 296 I/O pins provide flexibility for multi‑interface and high‑pin‑count connectivity.
- Compact package: 484‑CSPBGA (19×19) delivers a high‑density solution suitable for space‑constrained boards.
- Low‑voltage operation: 1.14–1.26 V supply range supports integration into low‑voltage systems.
- Commercial readiness: Surface‑mount package and 0 °C to 85 °C rating align with commercial electronic product requirements.
Why Choose XC6SLX100T-3CSG484C?
The XC6SLX100T-3CSG484C offers a balance of logic capacity, embedded memory, and I/O density in a compact surface‑mount FPGA package. Its specifications make it suitable for designers who need substantial programmable logic and on‑chip RAM while maintaining a low‑voltage supply profile and a commercial temperature rating.
This device is appropriate for development teams and procurement looking for a RoHS‑compliant, commercial‑grade FPGA with measurable resources: 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 296 I/Os in a 484‑CSPBGA package.
Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX100T-3CSG484C.

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