XC6SLX100T-2FGG900C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 498 4939776 101261 900-BBGA |
|---|---|
| Quantity | 271 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 498 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7911 | Number of Logic Elements/Cells | 101261 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX100T-2FGG900C – Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 498 4939776 101261 900-BBGA
The XC6SLX100T-2FGG900C is a Spartan®-6 LXT field programmable gate array supplied in a 900-ball BGA package. It integrates a high-capacity logic fabric, on-chip memory, and a large number of I/O pins to support complex digital designs.
With 101,261 logic elements across 7,911 configurable logic blocks and approximately 4.94 Mbits of embedded memory, this commercial-grade, surface-mount FPGA is suited to applications that require substantial logic resources and I/O density while operating within a 0 °C to 85 °C temperature range.
Key Features
- Logic Capacity 101,261 logic elements implemented across 7,911 configurable logic blocks (CLBs) for large-scale digital integration.
- Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffer, FIFO and memory-intensive functions.
- I/O Density 498 I/O pins provide substantial interface capacity for parallel buses, high-pin-count peripherals, or multiple I/O domains.
- Package 900-ball BGA package (supplier device package: 900-FBGA, 31 × 31) designed for surface-mount assembly.
- Power Operates from a core supply range of 1.14 V to 1.26 V, enabling integration into systems targeting those core-voltage rails.
- Operating Conditions Commercial-grade device rated for 0 °C to 85 °C operation.
- Regulatory RoHS compliant.
Unique Advantages
- High integration density: 101,261 logic elements and 7,911 CLBs allow consolidation of multiple functions into a single device, reducing PCB real estate and board-level complexity.
- Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM supports data buffering and local storage without external memory in many designs.
- Large I/O count: 498 I/Os enable broad peripheral connectivity and high-pin-count interfaces from a single FPGA package.
- Compact BGA packaging: The 900-ball 31 × 31 FBGA package delivers high-density routing in a surface-mount form factor suitable for space-constrained PCBs.
- Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications and environments.
- RoHS compliant: Meets RoHS requirements for restricted substances in electronic assemblies.
Why Choose XC6SLX100T-2FGG900C?
This Spartan‑6 LXT FPGA balances high logic capacity, significant embedded memory, and extensive I/O in a single commercial-grade BGA package. It is well suited for engineering teams and procurement organizations seeking a programmable device that consolidates logic, memory, and I/O connectivity into a compact surface-mount form factor.
Selecting the XC6SLX100T-2FGG900C supports designs that require scalable logic resources and on-chip RAM while maintaining a defined core voltage range and standard commercial temperature operation, providing predictable integration into existing system architectures.
Request a quote or submit a pricing inquiry to receive lead time and availability information for the XC6SLX100T-2FGG900C.

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