XC6SLX100T-2FGG900C

IC FPGA 498 I/O 900FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 498 4939776 101261 900-BBGA

Quantity 271 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package900-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case900-BBGANumber of I/O498Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7911Number of Logic Elements/Cells101261
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX100T-2FGG900C – Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 498 4939776 101261 900-BBGA

The XC6SLX100T-2FGG900C is a Spartan®-6 LXT field programmable gate array supplied in a 900-ball BGA package. It integrates a high-capacity logic fabric, on-chip memory, and a large number of I/O pins to support complex digital designs.

With 101,261 logic elements across 7,911 configurable logic blocks and approximately 4.94 Mbits of embedded memory, this commercial-grade, surface-mount FPGA is suited to applications that require substantial logic resources and I/O density while operating within a 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity  101,261 logic elements implemented across 7,911 configurable logic blocks (CLBs) for large-scale digital integration.
  • Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffer, FIFO and memory-intensive functions.
  • I/O Density  498 I/O pins provide substantial interface capacity for parallel buses, high-pin-count peripherals, or multiple I/O domains.
  • Package  900-ball BGA package (supplier device package: 900-FBGA, 31 × 31) designed for surface-mount assembly.
  • Power  Operates from a core supply range of 1.14 V to 1.26 V, enabling integration into systems targeting those core-voltage rails.
  • Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High integration density: 101,261 logic elements and 7,911 CLBs allow consolidation of multiple functions into a single device, reducing PCB real estate and board-level complexity.
  • Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM supports data buffering and local storage without external memory in many designs.
  • Large I/O count: 498 I/Os enable broad peripheral connectivity and high-pin-count interfaces from a single FPGA package.
  • Compact BGA packaging: The 900-ball 31 × 31 FBGA package delivers high-density routing in a surface-mount form factor suitable for space-constrained PCBs.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications and environments.
  • RoHS compliant: Meets RoHS requirements for restricted substances in electronic assemblies.

Why Choose XC6SLX100T-2FGG900C?

This Spartan‑6 LXT FPGA balances high logic capacity, significant embedded memory, and extensive I/O in a single commercial-grade BGA package. It is well suited for engineering teams and procurement organizations seeking a programmable device that consolidates logic, memory, and I/O connectivity into a compact surface-mount form factor.

Selecting the XC6SLX100T-2FGG900C supports designs that require scalable logic resources and on-chip RAM while maintaining a defined core voltage range and standard commercial temperature operation, providing predictable integration into existing system architectures.

Request a quote or submit a pricing inquiry to receive lead time and availability information for the XC6SLX100T-2FGG900C.

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