XC6SLX100T-4CSG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 101261 484-FBGA, CSPBGA |
|---|---|
| Quantity | 742 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7911 | Number of Logic Elements/Cells | 101261 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX100T-4CSG484C – Spartan®‑6 LXT FPGA, 484‑FBGA
The XC6SLX100T-4CSG484C is a Spartan®‑6 LXT field programmable gate array (FPGA) IC from AMD supplied in a 484‑FBGA (CSPBGA) package. It provides a balance of programmable logic capacity, embedded memory, and I/O density for compact, surface‑mount system designs.
Designed for commercial‑grade applications, this device supports a broad set of programmable digital functions where on‑chip memory, significant logic capacity, and flexible I/O are required within a 19×19 CSPBGA footprint.
Key Features
- Logic Capacity Approximately 101,261 logic elements, enabling substantial custom digital logic and function integration on a single device.
- Configurable Logic Blocks (CLBs) 7,911 CLBs to implement parallel and sequential logic structures for a wide range of designs.
- Embedded Memory Approximately 4.94 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory.
- I/O Density 296 I/O pins to support multiple external interfaces, sensors, and peripherals in I/O‑rich applications.
- Power Supply Core voltage range of 1.14 V to 1.26 V to match system power architectures and regulator choices.
- Package & Mounting 484‑CSPBGA (19×19) package, surface‑mount configuration for compact PCB layouts and high‑density board designs.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory compatibility.
Typical Applications
- Embedded Digital Systems Use as a programmable logic platform for custom control, data processing, and glue‑logic tasks in embedded products.
- High‑Density I/O Interfaces Act as an interface bridge or aggregator where numerous parallel or serial peripheral connections are required.
- Prototyping & Development Suitable for hardware validation and proof‑of‑concept work requiring substantial on‑chip logic and memory resources.
- Custom Logic Acceleration Implement application‑specific accelerators or offload tasks from a host processor using the device’s logic and embedded RAM.
Unique Advantages
- High Logic Density: Approximately 101,261 logic elements enable integration of complex digital functions into a single FPGA footprint.
- Substantial On‑Chip Memory: Nearly 4.94 Mbits of embedded RAM reduce dependence on external memory for buffering and local storage.
- Extensive I/O Resources: 296 available I/O pins provide flexibility for multi‑interface designs and peripheral expansion.
- Compact, Surface‑Mount Package: 484‑CSPBGA (19×19) supports space‑constrained PCBs while maintaining high pin count and signal density.
- Commercial‑Grade Operation: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
- Controlled Core Voltage: 1.14 V to 1.26 V supply range simplifies power planning for modern board designs.
Why Choose XC6SLX100T-4CSG484C?
The XC6SLX100T-4CSG484C positions itself as a versatile Spartan‑6 LXT FPGA option that balances logic capacity, embedded memory, and I/O count in a compact 484‑FBGA package. Backed by AMD manufacturing, it is suited to engineers and procurement teams looking to consolidate digital functions and reduce external component count while maintaining a surface‑mount form factor.
This device is well suited for development and production environments that require scalable programmable logic, on‑chip memory, and a high pin‑count interface in a commercial temperature range, providing long‑term value for mid‑range FPGA applications.
Request a quote or submit an inquiry to obtain pricing, availability, and delivery details for the XC6SLX100T-4CSG484C.

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