XC6SLX150-2FG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 338 4939776 147443 484-BBGA |
|---|---|
| Quantity | 889 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 338 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11519 | Number of Logic Elements/Cells | 147443 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX150-2FG484C – Spartan®-6 LX FPGA, 484‑BBGA
The XC6SLX150-2FG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It delivers a high logic-density FPGA fabric with 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and a broad I/O count in a compact BGA package.
Designed for commercial-temperature applications, this surface-mount device operates from a 1.14 V to 1.26 V supply and supports designs requiring significant on-chip logic, memory, and I/O resources in a 484-ball BGA footprint.
Key Features
- Core Logic 147,443 logic elements provide abundant programmable logic resources for complex digital designs.
- Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions.
- I/O Capacity 338 user I/Os enable extensive peripheral interfacing and board-level connectivity options.
- Power Operates from a supply range of 1.14 V to 1.26 V to meet the device’s core voltage requirements.
- Package & Mounting 484‑BBGA package case with supplier device package 484‑FBGA (23×23), optimized for surface-mount assembly.
- Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
- Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.
Unique Advantages
- High logic density: 147,443 logic elements enable implementation of sizable custom logic and algorithm acceleration within a single device.
- Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduce reliance on external memory for many buffering and data-path tasks.
- Extensive I/O: 338 I/Os allow flexible interfacing with sensors, peripherals, and board-level buses without immediate need for I/O expanders.
- Compact BGA footprint: 484‑BBGA (484‑FBGA 23×23) package balances density and board-space efficiency for surface-mount designs.
- Commercial-temperature suitability: Rated 0 °C to 85 °C for standard commercial applications where that operating range is required.
- Regulatory readiness: RoHS compliance simplifies adoption in lead-free product assemblies.
Why Choose XC6SLX150-2FG484C?
The XC6SLX150-2FG484C positions itself as a high-capacity Spartan‑6 LX FPGA option for designers needing significant programmable logic, embedded memory, and I/O in a single, surface-mount package. Its 147,443 logic elements combined with approximately 4.94 Mbits of on-chip RAM and 338 I/Os support complex, integrated digital designs within the constraints of a 484‑ball BGA footprint.
Backed by AMD as the manufacturer and designed for commercial-temperature operation with RoHS compliance, this part is suitable for engineers and procurement teams targeting robust, high-density FPGA implementations where available on-chip resources and compact packaging are priorities.
Request a quote or submit a request for pricing to explore using the XC6SLX150-2FG484C in your next design.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








