XC6SLX150-2FG484C

IC FPGA 338 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 338 4939776 147443 484-BBGA

Quantity 889 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O338Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150-2FG484C – Spartan®-6 LX FPGA, 484‑BBGA

The XC6SLX150-2FG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It delivers a high logic-density FPGA fabric with 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and a broad I/O count in a compact BGA package.

Designed for commercial-temperature applications, this surface-mount device operates from a 1.14 V to 1.26 V supply and supports designs requiring significant on-chip logic, memory, and I/O resources in a 484-ball BGA footprint.

Key Features

  • Core Logic 147,443 logic elements provide abundant programmable logic resources for complex digital designs.
  • Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions.
  • I/O Capacity 338 user I/Os enable extensive peripheral interfacing and board-level connectivity options.
  • Power Operates from a supply range of 1.14 V to 1.26 V to meet the device’s core voltage requirements.
  • Package & Mounting 484‑BBGA package case with supplier device package 484‑FBGA (23×23), optimized for surface-mount assembly.
  • Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
  • Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

  • High logic density: 147,443 logic elements enable implementation of sizable custom logic and algorithm acceleration within a single device.
  • Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduce reliance on external memory for many buffering and data-path tasks.
  • Extensive I/O: 338 I/Os allow flexible interfacing with sensors, peripherals, and board-level buses without immediate need for I/O expanders.
  • Compact BGA footprint: 484‑BBGA (484‑FBGA 23×23) package balances density and board-space efficiency for surface-mount designs.
  • Commercial-temperature suitability: Rated 0 °C to 85 °C for standard commercial applications where that operating range is required.
  • Regulatory readiness: RoHS compliance simplifies adoption in lead-free product assemblies.

Why Choose XC6SLX150-2FG484C?

The XC6SLX150-2FG484C positions itself as a high-capacity Spartan‑6 LX FPGA option for designers needing significant programmable logic, embedded memory, and I/O in a single, surface-mount package. Its 147,443 logic elements combined with approximately 4.94 Mbits of on-chip RAM and 338 I/Os support complex, integrated digital designs within the constraints of a 484‑ball BGA footprint.

Backed by AMD as the manufacturer and designed for commercial-temperature operation with RoHS compliance, this part is suitable for engineers and procurement teams targeting robust, high-density FPGA implementations where available on-chip resources and compact packaging are priorities.

Request a quote or submit a request for pricing to explore using the XC6SLX150-2FG484C in your next design.

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