XC6SLX150-2FG900I

The XC6SLX150-2FG900I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, provided in a 900‑BBGA package. It combines a high logic element count with substantial on-chip RAM and a large I/O complement to address demanding digital design requirements.

Delivered in an industrial-grade device with a 1.14 V to 1.26 V core supply range and an operating temperature window of −40 °C to 100 °C, this FPGA is designed for applications that require dense logic resources, embedded memory, and a high number of external interfaces in a compact BGA footprint.

Key Features

• Core Capacity — 11,519 configurable logic blocks (CLBs) supporting a total of 147,443 logic elements to implement complex digital logic and state machines.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM (4,939,776 total RAM bits) for buffering, FIFOs, and local storage.
• I/O Density — 576 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting — 900‑BBGA package (supplier device package: 900‑FBGA, 31 × 31 mm) with surface-mount construction for compact board integration.
• Power Supply — Core supply range from 1.14 V to 1.26 V, enabling predictable power planning for system designers.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in thermally demanding environments.
• Regulatory Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Complex digital systems — Large logic capacity enables implementation of sophisticated custom logic, protocol bridges, and hardware accelerators.
• High-channel I/O systems — The 576 I/O pins support multi-channel interfaces, wide parallel buses, and numerous peripheral connections.
• Embedded memory‑centric designs — Approximately 4.94 Mbits of on-chip RAM provide local buffering and temporary storage for data streams and real-time processing.

Unique Advantages

• High logic density: 147,443 logic elements allow integration of large digital functions on a single device, reducing board-level components.
• Substantial on-chip RAM: Nearly 5 Mbits of embedded memory minimizes external memory needs for many designs.
• Extensive I/O resources: 576 I/O pins provide flexibility for interfacing to multiple peripherals and high-pin-count connectors.
• Industrial-temperature capability: Rated −40 °C to 100 °C for deployment in environments with wide thermal ranges.
• Compact BGA packaging: 900‑BBGA (31 × 31 mm) balances high pin count with a manageable PCB footprint for dense system layouts.
• RoHS compliant: Supports lead‑free assembly and environmentally conscious manufacturing.

Why Choose XC6SLX150-2FG900I?

The XC6SLX150-2FG900I positions itself as a high-capacity Spartan‑6 LX FPGA option for designs that require a large number of logic elements, significant on-chip RAM, and a high I/O count in a compact BGA package. Its industrial operating range and controlled core voltage make it suitable for projects that demand predictable operation across temperature and power conditions.

This device is appropriate for engineering teams and procurement organizations looking to consolidate complex digital functionality onto a single FPGA, reduce board-level component counts, and maintain compatibility with surface-mount BGA assembly processes.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XC6SLX150-2FG900I and to begin the procurement process.