XC6SLX150-2FGG676C

The XC6SLX150-2FGG676C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD designed for commercial-grade programmable logic applications. It combines high logic density with substantial on-chip memory and a large I/O complement to support complex, custom digital designs.

Key attributes include 147,443 logic elements (organized into 11,519 CLBs), approximately 4.94 Mbits of embedded memory, and 498 user I/Os, all delivered in a 676-ball FBGA package suitable for surface-mount assembly.

Key Features

• Logic Fabric  147,443 logic elements organized into 11,519 CLBs provide a high-density programmable logic resource for complex designs.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• Programmable I/O  498 user I/Os enable broad interfacing flexibility for parallel buses, custom peripherals, and multi-channel I/O requirements.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match system power-rail constraints.
• Package & Mounting  676-FBGA (27×27) package, 676-BGA package case, and surface-mount mounting type for compact board-level integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant for environmental and regulatory compatibility in commercial products.

Typical Applications

• Commercial Embedded Systems  Provides high logic capacity and on-chip memory for feature-rich embedded controllers and appliance-level digital processing.
• Custom I/O and Interface Hubs  Large I/O count supports bespoke interface aggregation, bridging, and protocol adaptation tasks.
• Prototyping and Development Platforms  High logic element count and significant embedded RAM allow system architects to prototype complex digital functions and validate designs.

Unique Advantages

• High Logic Density: 147,443 logic elements enable implementation of large, complex logic functions within a single device, reducing system-level component count.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM supports local data buffering and state machines without external memory.
• Extensive I/O Capacity: 498 user I/Os simplify integration with multiple peripherals, sensors, and parallel interfaces.
• Compact BGA Footprint: 676-FBGA (27×27) package balances I/O density with a compact board footprint for space-constrained designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet common commercial deployment and regulatory needs.
• AMD Manufacturer Backing: Supplied by AMD, offering a recognized vendor for sourcing and specification consistency.

Why Choose XC6SLX150-2FGG676C?

The XC6SLX150-2FGG676C positions itself as a high-density, commercial-grade FPGA choice for designers who need substantial logic capacity, meaningful on-chip RAM, and a wide I/O complement in a compact BGA package. Its specified core voltage range and surface-mount 676-FBGA package make it suitable for tightly integrated boards where board space and I/O count are priorities.

Backed by AMD, this FPGA is suited for teams building commercial embedded systems, custom interface solutions, and development platforms that require scalable programmable logic and reliable, verifiable hardware parameters.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6SLX150-2FGG676C.