XC6SLX150-2FGG900C

The XC6SLX150-2FGG900C is a Spartan®-6 LX field programmable gate array (FPGA) in a 900-ball BGA package designed for commercial-grade embedded applications. It delivers a large programmable fabric with approximately 147,443 logic elements, substantial on‑chip memory and a high I/O count for designs that require dense logic integration and extensive interfacing.

This device is supplied in a 900-BBGA / 900-FBGA (31×31) package, supports surface-mount assembly, and is RoHS compliant. It operates from a core supply range of 1.14 V to 1.26 V and is specified for use across a 0 °C to 85 °C commercial temperature range.

Key Features

• Programmable Logic Capacity — Approximately 147,443 logic elements to implement complex digital designs and custom hardware functions.
• Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM for buffering, lookup tables and local storage within the FPGA fabric.
• High I/O Count — 576 general-purpose I/O pins to support multiple parallel interfaces, front‑panel connections or board-level peripherals.
• Package and Mounting — 900‑BBGA package (supplier device package: 900‑FBGA, 31×31) optimized for surface-mount assembly on dense PCBs.
• Power — Core voltage supply range of 1.14 V to 1.26 V for reliable core operation within specified limits.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for deployment in commercial environments.
• Regulatory — RoHS compliant for use in lead‑free manufacturing processes.

Typical Applications

• Embedded System Integration — Implement custom control logic, protocol bridging and system glue in compact commercial products using the FPGA’s large logic array and abundant I/O.
• High‑I/O Interface Control — Manage multiple parallel and serial interfaces where a high pin count and configurable I/O are required.
• On‑board Data Handling — Use the device’s embedded memory to support buffering, packet handling or temporary data storage within digital signal and control paths.

Unique Advantages

• High Logic Density: Approximately 147,443 logic elements enable implementation of sizeable custom hardware functions without off‑chip logic.
• Substantial Embedded Memory: Approximately 4.94 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and lookup tasks.
• Extensive I/O: 576 I/O pins provide flexibility to connect to multiple peripherals and I/O standards at the board level.
• Compact BGA Package: 900‑BBGA / 900‑FBGA (31×31) packaging delivers high pin density in a board‑space efficient footprint.
• Commercial Reliability: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product manufacturing and deployment.

Why Choose XC6SLX150-2FGG900C?

The XC6SLX150-2FGG900C positions itself as a robust commercial-grade FPGA option when substantial programmable logic, ample embedded memory and a large I/O complement are required in a compact BGA package. Its specification set supports integration of complex digital functions and multiple interfaces while maintaining compatibility with surface-mount assembly and lead‑free manufacturing flows.

This device suits engineering teams building commercial embedded systems that need scalable programmable logic capacity and on‑chip memory to consolidate functions, reduce external components, and streamline board-level design. Its defined voltage and temperature ranges help ensure predictable integration into commercial product designs.

Request a quote or submit your procurement inquiry to receive pricing and availability details for XC6SLX150-2FGG900C. Our team can assist with lead times and order placement to support your project schedule.