XC6SLX150-2FGG900I

The XC6SLX150-2FGG900I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for configurable digital logic in industrial applications. It combines substantial logic capacity, embedded RAM, and a high I/O count in a compact 900-ball BGA package.

This device targets designs that require reconfigurable logic and significant on-chip memory while operating across industrial temperature ranges, offering a balance of integration and system-level flexibility.

Key Features

• Logic Capacity – Contains 147,443 logic elements to implement complex custom logic and state machines.
• Embedded Memory – Approximately 4.94 Mbits of embedded memory for buffering, FIFOs, and local data storage.
• I/O Density – 576 user I/Os to support parallel interfaces, wide data buses, and multiple external peripherals.
• Power – Core voltage support from 1.14 V to 1.26 V to match system power domains and regulator choices.
• Package – 900-BBGA package; supplier package listed as 900-FBGA (31 × 31) for high pin-count, compact board integration.
• Mounting & Compliance – Surface mount device and RoHS compliant for modern assembly and environmental requirements.
• Temperature & Grade – Industrial grade operation over a −40 °C to 100 °C range for deployment in demanding environments.

Typical Applications

• Industrial Control – Implement real-time control logic, custom interfaces, and sensor aggregation with high I/O count and industrial temperature tolerance.
• Embedded Systems – Use as a configurable fabric for system glue logic, protocol conversion, and local buffering leveraging on-chip memory.
• Data Aggregation & Preprocessing – Perform data alignment, framing, and temporary storage using the device’s embedded RAM and extensive I/O.

Unique Advantages

• Balanced Integration: Combines large logic capacity and substantial embedded memory to reduce external components and simplify board design.
• High I/O Count: 576 I/Os enable direct connection to multiple peripherals and wide parallel buses, minimizing interface bottlenecks.
• Industrial Readiness: Industrial-grade temperature rating (−40 °C to 100 °C) supports deployment in harsher operating environments.
• Compact High-Pin Package: 900-BBGA (900-FBGA, 31 × 31) offers dense routing and form-factor efficiency for space-constrained designs.
• Controlled Core Supply: Narrow core voltage range (1.14 V–1.26 V) aids predictable power budgeting and regulator selection.
• RoHS Compliant: Meets environmental compliance expectations for modern manufacturing and product lifecycles.

Why Choose XC6SLX150-2FGG900I?

The XC6SLX150-2FGG900I positions itself as a versatile, industrial-grade FPGA that balances logic capacity, embedded memory, and a large I/O footprint in a compact BGA package. Its specifications make it suitable for engineers building industrial and embedded systems that require reconfigurable logic, on-chip buffering, and dense external connectivity.

Manufactured by AMD and offered in a RoHS-compliant surface-mount package, this device provides long-term value for designs that need scalability, reliability, and straightforward integration into production assemblies.

Request a quote or submit a procurement inquiry to begin sourcing the XC6SLX150-2FGG900I for your next design.