XC6SLX150-2FGG484I

The XC6SLX150-2FGG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, provided in a 484-BBGA package. It combines large logic capacity, substantial embedded memory, and a high count of I/O to address demanding industrial designs that require configurable digital logic and flexible interfacing.

Key Features

• Logic Capacity — 147,443 logic elements available for implementing complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 338 user I/O pins to support wide-ranging peripheral and interface connectivity requirements.
• Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount construction for compact, high-density board layouts.
• Power — Core supply range of 1.14 V to 1.26 V to match system power architectures.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C and specified as Industrial grade for use in temperature-challenging environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free compliance.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature range and extensive I/O make this FPGA suitable for control logic, protocol bridging, and sensor/actuator interfacing.
• Data Buffering and Local Processing — Approximately 4.94 Mbits of embedded RAM supports on-chip buffering and intermediate data storage for streaming or packetized data flows.
• Custom Interface Gateways — High I/O count enables implementation of multi-protocol gateways and bespoke peripheral interfaces within a single device.

Unique Advantages

• High Logic Density: 147,443 logic elements provide the capacity to integrate complex digital functions and reduce external component count.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces the need for external memory and simplifies board design.
• Extensive I/O: 338 user I/O pins enable broad connectivity to sensors, actuators, and communication interfaces without multiplexing compromises.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and classified as Industrial grade for use in temperature-sensitive deployments.
• Compact BGA Packaging: 484-BBGA (23×23) surface-mount package allows for high-density board layouts while maintaining robust thermal and mechanical characteristics.
• Regulatory Compliance: RoHS compliance supports deployment in lead-free manufacturing environments.

Why Choose XC6SLX150-2FGG484I?

The XC6SLX150-2FGG484I positions itself as a high-capacity, industrial-grade Spartan®-6 LX FPGA option from AMD, combining a large number of logic elements, meaningful on-chip memory, and a high I/O count in a compact 484-BBGA package. These attributes make it suitable for engineers who need to consolidate custom digital logic, interface density, and on-chip buffering into a single, manufacturer-backed device.

This FPGA is well suited to design teams focused on scalable, robust implementations where operating temperature range, I/O connectivity, and on-chip resources matter. Its specification-driven feature set supports longer-term design goals by reducing BOM complexity and enabling flexible hardware reconfiguration during product development and maintenance.

Request a quote or submit an inquiry for the XC6SLX150-2FGG484I to receive pricing and availability information tailored to your project requirements.