XC6SLX150-2FG484I

The XC6SLX150-2FG484I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD in a 484‑BBGA package. It delivers a sizable logic fabric and on-chip memory with a broad I/O count and is specified for industrial temperature operation.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory and 338 user I/Os, this device targets designs requiring high I/O density, significant programmable logic capacity, and reliable operation across a –40 °C to 100 °C ambient range.

Key Features

• Programmable Logic Core  11,519 configurable logic blocks (CLBs) supporting a total of 147,443 logic elements for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM (4,939,776 total RAM bits) for data buffering, FIFOs, and memory-mapped logic structures.
• I/O Density  338 dedicated I/O pins enable extensive external interfacing for high-pin-count applications and multi-channel connectivity.
• Package & Mounting  484‑BBGA (supplier package: 484‑FBGA 23×23) in a surface-mount format to support compact board layouts and high-density system designs.
• Power Supply  Core supply range specified from 1.14 V to 1.26 V to match system power rails and design constraints.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to meet the needs of industrial environments.
• Regulatory Compliance  RoHS compliant to support lead‑free manufacturing and environmental requirements.

Typical Applications

• Industrial Control  Used for programmable control logic, interfacing and real‑time signal processing where industrial temperature operation and high I/O count are required.
• High‑I/O Embedded Systems  Suited to systems that need many external connections—such as multi‑channel data acquisition or sensor aggregation—leveraging 338 I/Os.
• Memory‑centric Logic  Designs that require significant on‑chip buffering, packet storage or lookup tables can take advantage of approximately 4.94 Mbits of embedded RAM.

Unique Advantages

• Substantial Logic Capacity: 147,443 logic elements enable implementation of large custom accelerators, protocol engines or glue logic without external components.
• High I/O Count: 338 I/Os reduce the need for additional I/O expanders, simplifying PCB routing and lowering BOM complexity.
• Embedded Memory Resources: Approximately 4.94 Mbits of on‑chip RAM support data buffering and state storage for latency‑sensitive applications.
• Industrial Temperature Rating: –40 °C to 100 °C specification supports deployment in harsh or temperature‑variable environments.
• Compact, Surface‑Mount Package: 484‑BBGA (23×23 FBGA footprint) provides a high‑density package option for space‑constrained designs.
• RoHS Compliance: Conforms to lead‑free manufacturing requirements to ease regulatory and assembly considerations.

Why Choose XC6SLX150-2FG484I?

The XC6SLX150-2FG484I balances large programmable logic capacity, significant embedded memory and a high I/O count in a compact 484‑BBGA package, making it well suited for industrial and high‑I/O embedded applications. Its specified voltage range and industrial temperature rating provide predictable integration into systems with defined power and environmental constraints.

This device is appropriate for designers needing a robust, scalable FPGA platform to consolidate logic, reduce external components, and support long‑term deployment in temperature‑challenging environments.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX150-2FG484I. Our team can provide lead‑time and ordering details to support your project timeline.