XC6SLX150-2FG676I

The XC6SLX150-2FG676I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. This industrial-grade, surface-mount device provides a high logic capacity along with substantial on-chip memory and a large I/O complement in a 676-FBGA (27×27) package.

Key physical and electrical characteristics include 147,443 logic elements, approximately 4.94 Mbits of embedded memory, 498 user I/O pins, a core voltage supply range of 1.14 V to 1.26 V, and an operating temperature range of -40 °C to 100 °C.

Key Features

• Logic Capacity — 147,443 logic elements enable implementation of complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
• I/O Resources — 498 user I/O pins accommodate extensive external interfacing and high pin-count designs.
• Power Supply — Core voltage range of 1.14 V to 1.26 V for compatibility with low-voltage FPGA power architectures.
• Package & Mounting — 676-BGA package (supplier device package: 676-FBGA 27×27) in a surface-mount form factor for compact, board-level integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet a wide range of environmental requirements.
• Manufacturer — Designed and produced by AMD.

Typical Applications

• Industrial Embedded Systems — Suitable for designs that require an industrial temperature range (-40 °C to 100 °C) and robust on-board logic and memory resources.
• High I/O Board Designs — Well suited to applications needing a large number of user I/O signals, leveraging the 498-pin I/O count.
• Compact, High-Pin-Count Implementations — The 676-FBGA (27×27) surface-mount package supports dense, space-constrained PCB layouts.
• Low-Voltage Core Architectures — Use in systems that conform to a 1.14 V–1.26 V core supply requirement.

Unique Advantages

• High Logic Density: 147,443 logic elements provide substantial programmable resources for complex designs without external CPLD/FPGA partitioning.
• Ample On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O Count: 498 user I/O pins enable broad peripheral connectivity and multiple parallel interfaces.
• Industrial Operating Range: Rated from -40 °C to 100 °C to support deployment in demanding environments.
• Compact, High-Pin Package: 676-FBGA (27×27) surface-mount package delivers a balance of pin count and board-level density.
• Defined Core Voltage Range: 1.14 V–1.26 V core supply simplifies power supply planning for low-voltage designs.

Why Choose XC6SLX150-2FG676I?

The XC6SLX150-2FG676I positions itself as a capable Spartan®-6 LX FPGA option for projects demanding a combination of high logic capacity, meaningful on-chip memory, and a large I/O count within a compact 676-FBGA package. Its industrial temperature rating and defined core voltage range make it suitable for designs requiring environmental robustness and predictable power requirements.

This device is appropriate for engineers and procurement teams specifying FPGAs for board-level designs that need substantial programmable resources, broad interfacing capability, and a surface-mount, high-pin-count package form factor. Backed by AMD manufacturing, it offers a clear specification set for integration into long-lived, scalable designs.

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