XC6SLX150-2FGG484C

The XC6SLX150-2FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) designed for commercial electronic designs. It provides a high count of programmable logic resources and on-chip memory in a compact 484-ball BGA package, supporting dense custom logic implementations and significant I/O integration.

Key attributes include 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 338 I/O pins, making it suitable for commercial applications that require substantial logic density and I/O connectivity within a surface-mount package.

Key Features

• Programmable Logic  147,443 logic elements for implementing complex digital logic and custom hardware functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support FIFOs, buffers, and embedded data storage.
• I/O Capacity  338 user I/O pins to accommodate wide parallel interfaces and mixed-signal connectivity at the board level.
• Package and Mounting  484-BBGA package (supplier device package listed as 484-FBGA, 23×23) in a surface-mount form factor for compact PCB designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for standard environmental and regulatory adherence in commercial products.

Typical Applications

• Custom digital logic and hardware acceleration  Implement algorithm acceleration and custom state machines using the device’s 147,443 logic elements and embedded RAM.
• I/O-intensive commercial systems  Use the 338 I/O pins to consolidate interfaces, bridge multiple buses, or handle parallel data streams in compact systems.
• Compact surface-mount designs  The 484-BBGA surface-mount package supports high-density board layouts where board area and I/O routing are critical.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of large, complex digital designs without external logic expansion.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces the need for external memory for buffering and intermediate data storage.
• Extensive I/O complement: 338 I/O pins provide flexibility for integrating multiple interfaces and peripherals directly on-chip.
• Compact BGA footprint: 484-ball BGA (484-FBGA, 23×23) supports high-density PCB assembly while maintaining robust electrical connections.
• Commercial temperature and RoHS compliance: Operates across 0 °C to 85 °C and is RoHS compliant, aligning with standard commercial product requirements.
• Defined core voltage range: Core supply specification of 1.14 V to 1.26 V helps ensure predictable power integration in system design.

Why Choose XC6SLX150-2FGG484C?

The XC6SLX150-2FGG484C from AMD combines a large pool of programmable logic resources with significant on-chip memory and broad I/O capacity in a compact surface-mount BGA package. Its commercial-grade operating range and RoHS compliance make it well suited to a wide range of commercial embedded designs that require dense logic implementation and integrated I/O.

This FPGA is appropriate for engineers and teams building scalable, logic-heavy applications who need predictable electrical characteristics (core voltage 1.14–1.26 V) and a high count of user I/Os. The part delivers a balance of integration and capacity that supports medium- to large-scale custom logic deployments in commercial products.

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