XC6SLX150-2FGG676I

The XC6SLX150-2FGG676I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD designed for high-density, industrial-grade digital logic integration. This device combines a large logic fabric with substantial embedded RAM and a high I/O count, making it suitable for industrial applications and board-level systems that require configurable digital processing and extensive connectivity.

Key Features

• Logic Capacity — Provides 147,443 logic elements to implement complex digital functions and custom hardware accelerators.
• Configurable Logic Blocks (CLBs) — Contains 11,519 CLBs for flexible partitioning of logic and efficient resource mapping.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage without external memory.
• I/O Density — 498 general-purpose I/O pins to support wide parallel interfaces, multiple peripherals, and board-level I/O routing.
• Power Supply — Core voltage range of 1.14 V to 1.26 V for defined power planning and supply design.
• Package & Mounting — Supplied in a 676-ball BGA package (676-FBGA, 27 × 27) for high-pin-count, surface-mount board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Compliance — RoHS compliant, supporting environmental and supply-chain requirements.

Typical Applications

• Industrial Control Systems — Suitable for programmable control, custom logic, and I/O handling in industrial automation where an industrial temperature grade is required.
• High-Density Logic Integration — Useful for designs that require hundreds of thousands of logic elements and substantial on-chip memory for algorithm acceleration or protocol handling.
• Board-Level I/O Expansion — With 498 I/Os, ideal for bridging, aggregation, and interfacing tasks that demand many parallel or multiplexed signals.

Unique Advantages

• High Logic Density: 147,443 logic elements enable implementation of complex, multi-function designs on a single device, reducing component count.
• Substantial On-Chip RAM: Approximately 4.94 Mbits of embedded memory reduces the need for external RAM in many buffering and storage use cases.
• Extensive I/O Capability: 498 I/Os provide flexibility for connecting multiple peripherals, sensors, and subsystems without external multiplexing.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for deployments in thermally demanding environments.
• High-Pin-Count BGA Package: The 676-FBGA (27 × 27) package supports dense routing and board-level integration for sophisticated designs.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6SLX150-2FGG676I?

The XC6SLX150-2FGG676I positions itself as a high-density, industrial-grade FPGA platform that balances large logic capacity, meaningful on-chip memory, and a wide I/O footprint in a 676-ball BGA package. It is well suited for engineers and designers building industrial systems, complex logic subsystems, and board-level solutions that require configurable hardware resources and reliable operation across a broad temperature range.

Choosing this FPGA provides a clear path to consolidate multiple functions into a single programmable device, helping reduce BOM complexity and enabling flexible, field-upgradeable designs with verifiable electrical and environmental parameters.

If you would like pricing, availability, or to request a quote for the XC6SLX150-2FGG676I, please submit a quote request or contact sales to initiate your purchase inquiry.