XC6SLX150-3CSG484I

The XC6SLX150-3CSG484I is an industrial-grade Spartan®-6 LX FPGA manufactured by AMD. It delivers 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 338 I/Os in a compact surface-mount BGA package.

Designed for industrial applications, the device operates from a core supply range of 1.14 V to 1.26 V and across an operating temperature range of −40 °C to 100 °C. The device is supplied in a 484-CSPBGA (19×19) / 484-FBGA package and is RoHS compliant.

Key Features

• Core density  147,443 logic elements for implementing complex custom logic and control functions.
• Embedded memory  Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) for buffering, state storage, and local data processing.
• I/O capacity  338 I/Os to support broad parallel interfacing and signal routing without extensive external multiplexing.
• Power supply  Core supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & mounting  484-CSPBGA (19×19) / 484-FBGA footprint in a surface-mount package for compact PCB integration.
• Temperature & grade  Industrial-grade device with an operating range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Industrial control and automation  Use the device's logic density and industrial temperature range for control algorithms, PLC expansion, and real-time I/O handling.
• I/O-intensive systems  Leverage 338 I/Os for sensor aggregation, parallel data capture, and high-channel-count interfacing.
• Memory-buffered signal processing  Approximately 4.94 Mbits of on-chip RAM supports local buffering and intermediate data storage for custom processing pipelines.
• Embedded system integration  Compact 484-CSPBGA (19×19) surface-mount package suits space-constrained boards requiring high logic and I/O integration.

Unique Advantages

• High logic capacity: 147,443 logic elements enable large-scale custom logic implementations without immediate external logic expansion.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 338 I/Os provide flexibility for complex interfacing and parallel connectivity, lowering BOM and board complexity.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in a wide range of industrial environments.
• Compact BGA footprint: 484-CSPBGA (19×19) surface-mount package allows high-density PCB layouts while maintaining robust connectivity.
• RoHS compliant: Meets environmental compliance needs for regulated assemblies.

Why Choose XC6SLX150-3CSG484I?

The XC6SLX150-3CSG484I positions itself as an industrial-grade, high-density FPGA solution from AMD, combining significant logic capacity, embedded memory, and a large I/O count in a compact surface-mount BGA package. Its operating voltage range and −40 °C to 100 °C temperature rating make it suitable for demanding embedded and industrial designs that require integration and robustness.

Designers and procurement teams seeking a scalable, high-integration FPGA for industrial control, I/O-heavy systems, or memory-buffered processing will find this device well suited to reduce external components and streamline PCB designs while maintaining environmental compliance.

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