XC6SLX150-3FG676I

The XC6SLX150-3FG676I is an industrial-grade Spartan®-6 LX field programmable gate array from AMD. It provides programmable logic with approximately 147,443 logic elements and approximately 4.94 Mbits of embedded memory, enabling complex, application-specific digital designs.

Designed for demanding environments, the device offers 498 I/O pins, a 676-FBGA (27×27) surface-mount package, and an industrial operating temperature range of −40 °C to 100 °C. It operates from a core supply of 1.14 V to 1.26 V and is RoHS compliant.

Key Features

• Programmable Logic Density  Approximately 147,443 logic elements provide high-density programmable resources for custom digital functions and control logic.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, FIFOs, and lookup table storage to support data-intensive logic.
• I/O Connectivity  498 general-purpose I/O pins enable broad peripheral interfacing and flexible system integration.
• Package and Mounting  676-FBGA (27×27) package with surface-mount mounting for compact, PCB-mounted implementations.
• Power  Core voltage supply range of 1.14 V to 1.26 V for defined power planning and supply design.
• Temperature and Reliability  Industrial operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Environmental Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Implement machine control logic and deterministic I/O handling where the −40 °C to 100 °C rating and high I/O count are required.
• Embedded Processing  Use on-chip logic and approximately 4.94 Mbits of memory for custom processing engines, accelerators, and data path functions.
• Communications and Interfaces  Support protocol bridging, data framing, and signal conditioning with abundant I/O and programmable logic resources.

Unique Advantages

• High logic capacity: Approximately 147,443 logic elements enable complex designs without external programmable logic.
• Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O: 498 I/Os provide flexibility for interfacing to sensors, peripherals, and high-pin-count connectors.
• Industrial rating: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
• Compact surface-mount BGA: 676-FBGA (27×27) package balances board space efficiency with high pin count for dense system designs.
• Regulatory alignment: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC6SLX150-3FG676I?

The XC6SLX150-3FG676I delivers a combination of high-density programmable logic, substantial on-chip memory, and a large I/O complement in a compact 676-FBGA package. Its industrial temperature rating and defined supply range make it suitable for embedded and control applications that require reliable operation across a wide temperature span.

Backed by AMD's Spartan®-6 family architecture, the device is a practical choice for engineers and procurement teams seeking scalable FPGA resources, straightforward power requirements, and RoHS-compliant manufacturing readiness.

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