XC6SLX150-3FG900C

The XC6SLX150-3FG900C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) offered in a 900-ball BGA package. This commercial-grade FPGA provides a large logic fabric and on-chip memory suitable for FPGA-based designs that require high I/O density and substantial embedded RAM.

Key device characteristics include 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 576 user I/Os, making it a fit for designs that need significant logic capacity and I/O connectivity while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C ambient temperature range.

Key Features

• Core Architecture  Spantan®-6 LX series FPGA core in a commercial-grade device designed for FPGA-based system designs.
• Logic Capacity  147,443 logic elements provide extensive programmable logic resources for complex designs.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• High I/O Count  576 user I/Os to support dense connectivity to peripherals, memory interfaces, or external devices.
• Power Supply  Operates from a 1.14 V to 1.26 V supply range, enabling consistent core power requirements across designs.
• Package and Mounting  900-ball BGA package (supplier package: 900-FBGA, 31 × 31) with surface-mount mounting for board-level integration.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• FPGA-based system designs  Leverages large logic capacity and on-chip RAM to implement custom digital logic and control functions.
• I/O-intensive subsystems  The 576 user I/Os support dense peripheral and interface connectivity for board-level designs.
• Memory-centric applications  Approximately 4.94 Mbits of embedded memory enables local buffering and state storage within the FPGA fabric.
• Commercial electronics  Designed for commercial-grade products operating within 0 °C to 85 °C where substantial programmable logic is required.

Unique Advantages

• Highly integrated logic capacity: 147,443 logic elements reduce the need for external programmable logic and simplify system architecture.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM supports buffering, FIFOs, and temporary data storage without external memory.
• Extensive I/O connectivity: 576 user I/Os enable broad interface options and high-density board-level integration.
• Compact BGA package: 900-ball BGA (900-FBGA, 31 × 31) provides a high pin-count solution in a surface-mount footprint for modern PCB layouts.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to meet the environmental needs of commercial applications.
• RoHS compliant: Meets common environmental compliance requirements for commercial electronics.

Why Choose XC6SLX150-3FG900C?

The XC6SLX150-3FG900C positions itself as a high-capacity, commercial-grade Spartan®-6 LX FPGA that balances large programmable logic, significant embedded memory, and a high I/O count in a compact 900-ball BGA package. Its specified core voltage range and operating temperature make it suitable for a wide range of commercial electronic designs.

This FPGA is ideal for designers and engineers who need extensive on-chip logic and connectivity while maintaining a surface-mount BGA form factor. The device offers a clear upgrade path within FPGA-based architectures and provides long-term value through a combination of integration, capacity, and compliance with RoHS requirements.

Request a quote or submit a pricing inquiry to initiate a procurement or design evaluation for the XC6SLX150-3FG900C. Our team will respond with availability and ordering details.