XC6SLX150-3FGG484I

The XC6SLX150-3FGG484I is an industrial-grade Spartan®-6 LX field programmable gate array from AMD. It delivers a high-density programmable fabric with a large number of logic elements, substantial on-chip RAM, and a broad I/O complement in a compact surface-mount BGA package.

With an operating voltage range of 1.14 V to 1.26 V and an operating temperature range from −40 °C to 100 °C, this device is targeted at applications that require programmable logic capacity and reliable operation in industrial environments.

Key Features

• High logic capacity — 147,443 logic elements provide substantial programmable resources for complex digital designs.
• Embedded memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage.
• Generous I/O — 338 user I/O pins to interface with peripherals, sensors, and external logic without extensive external glue logic.
• Power supply — Operates from 1.14 V to 1.26 V, compatible with precision core-voltage domains common to Spartan®-6 devices.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C for use in demanding environments.
• Package and mounting — 484-BBGA (supplier package: 484-FBGA, 23 × 23 mm) surface-mount package for compact system designs.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial automation — Implement motor control logic, process sequencing, and custom control paths where industrial temperature tolerance is required.
• Embedded processing and control — Integrate custom state machines, data path logic, and protocol handling using abundant logic elements and on-chip RAM.
• I/O consolidation and bridging — Aggregate and bridge multiple peripheral interfaces with 338 available I/O pins to minimize external components.
• Prototyping and custom logic acceleration — Use the device’s capacity for development of specialized hardware accelerators and iterative design validation.

Unique Advantages

• Large programmable fabric: 147,443 logic elements enable implementation of complex designs without immediate migration to larger device families.
• Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependence on external memory for many buffering and intermediate storage needs.
• High I/O count: 338 I/O pins let designers connect numerous peripherals and interfaces directly, simplifying board-level design.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in harsher environmental conditions.
• Compact BGA packaging: 484-BBGA (23 × 23 mm) surface-mount package offers a balance of density and board-space efficiency for embedded systems.
• Regulatory readiness: RoHS compliance supports environmental and supply-chain requirements.

Why Choose XC6SLX150-3FGG484I?

The XC6SLX150-3FGG484I positions itself as a high-capacity, industrial-grade FPGA option for engineers who need substantial programmable resources, on-chip memory, and a large I/O footprint in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for industrial designs that require reliable, standards-conscious components.

Backed by AMD’s Spartan®-6 family pedigree, this device is appropriate for development teams focusing on embedded control, I/O-intensive systems, and custom hardware acceleration where long-term availability and a balance of integration and performance are key considerations.

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