XC6SLX150-3FG900I

The XC6SLX150-3FG900I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 900-ball BGA package. It delivers high logic density and on-chip memory with a broad I/O complement, packaged for surface-mount assembly and rated for industrial temperature operation.

Designed for applications that require substantial programmable logic, abundant embedded memory, and large I/O capacity, this device offers a combination of integration and robustness for industrial designs operating from -40 °C to 100 °C.

Key Features

• Logic Capacity — 147,443 logic elements providing significant programmable logic resources for complex designs.
• Configurable Logic Blocks (CLBs) — 11,519 CLBs to implement combinational and sequential logic structures.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM for data buffering, FIFOs and local storage.
• I/O Resources — 576 user I/O pins for extensive peripheral and interface connectivity.
• Power Supply — Core supply range from 1.14 V to 1.26 V to match target system power architectures.
• Package and Mounting — 900-BBGA (900-FBGA, 31×31) surface-mount package for high pin-count, compact board layouts.
• Industrial Temperature Rating — Specified for operation from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and large I/O count to implement control logic, sensor interfacing, and actuator drivers in factory and process automation.
• Embedded Systems — High logic capacity and on-chip memory enable complex state machines, protocol handling, and custom peripheral aggregation in embedded products.
• Interface and I/O Aggregation — The 576 I/Os support multi-channel signal routing, protocol bridging, and high-density board-level interfacing.

Unique Advantages

• High Logic Density: 147,443 logic elements allow integration of complex functions on a single device, reducing external component count.
• Substantial Embedded Memory: Approximately 4.94 Mbits of RAM enables local buffering and low-latency data paths without external memory.
• Extensive I/O Capacity: 576 I/O pins provide flexibility for connecting multiple peripherals, sensors, and interfaces.»
• Industrial Robustness: Rated for -40 °C to 100 °C, suitable for deployments that demand extended temperature operation.
• Compact High-Pin Package: 900-BBGA (31×31) delivers a high pin count in a compact footprint for space-constrained designs.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V supports designs targeting modern low-voltage power domains.

Why Choose XC6SLX150-3FG900I?

The XC6SLX150-3FG900I positions itself as a high-density, industrial-grade FPGA option for designers who need large programmable logic resources, significant on-chip memory, and broad I/O capability in a compact 900‑ball BGA package. Its specification set supports demanding embedded and industrial workflows where integration and thermal robustness matter.

This device is well-suited for development teams and OEMs focused on consolidating system logic, minimizing external components, and delivering reliable operation across a wide temperature range.

Request a quote for the XC6SLX150-3FG900I today to evaluate its fit for your next design or submit a quote inquiry to get pricing and availability information.