XC6SLX150-3FGG676I

The XC6SLX150-3FGG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD designed for demanding industrial applications. It provides a high logic capacity and ample embedded memory in a compact 676-ball BGA package, making it suitable for systems that require configurable digital logic and dense I/O integration.

With an industrial operating temperature range and RoHS compliance, this device targets designs that need reliable operation across wide temperature conditions while offering a significant number of I/Os and on-chip memory for complex, memory‑centric functions.

Key Features

• Logic Capacity  Provides 147,443 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive processing.
• High I/O Count  498 I/O pins for extensive interfacing to peripherals, sensors, and external devices.
• Power Supply  Core voltage supply range from 1.14 V to 1.26 V to match system power domains.
• Package and Mounting  676-ball FBGA (27 × 27 mm) package in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support harsh and temperature-variable environments.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

• Industrial Control and Automation  Use the FPGA’s large logic capacity and industrial temperature rating for control algorithms, sequencing, and real-time processing in factory and process automation equipment.
• High-Density I/O Interfaces  Leverage 498 I/Os to aggregate and manage numerous sensors, actuators, and communication lines in complex system interfaces.
• Embedded Memory-Intensive Functions  Deploy on-chip RAM for buffering, packet handling, or lookup-table‑based processing in embedded systems.

Unique Advantages

• High Logic Integration: 147,443 logic elements enable substantial on-chip implementation of custom digital logic, reducing external component count.
• Significant Embedded Memory: Approximately 4.94 Mbits of RAM supports local data storage and processing without immediate reliance on external memory devices.
• Extensive Connectivity: 498 I/Os give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to maintain functionality across broad thermal environments.
• Compact Surface-Mount Package: 676-FBGA (27 × 27) provides a high pin-count solution in a space-efficient form factor for dense PCB designs.
• Environmental Compliance: RoHS compliance supports regulatory and sustainability requirements for many industrial applications.

Why Choose XC6SLX150-3FGG676I?

The XC6SLX150-3FGG676I combines a high logic element count, substantial embedded memory, and a large I/O complement in a compact 676‑ball BGA package, positioning it for industrial designs that demand configurable logic and broad interfacing. Its core voltage range and industrial temperature rating make it suited for systems requiring stable, long-term operation across varying thermal conditions.

This FPGA is well suited for engineers and procurement teams building industrial control, embedded processing, or high‑I/O interface applications that benefit from on-chip memory and dense logic resources, while meeting RoHS environmental requirements.

Request a quote or submit a pricing inquiry to evaluate the XC6SLX150-3FGG676I for your next design project.