XC6SLX150-3FGG900I

The XC6SLX150-3FGG900I is an AMD Spartan®-6 LX field programmable gate array supplied in a 900-BBGA package. It combines high logic density with substantial on-chip memory and a large I/O count to address designs that require complex, configurable digital logic in an industrial-grade component.

This device is specified for a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that demand defined thermal and power operating windows.

Key Features

• Core Logic Provides 147,443 logic elements to implement complex custom digital logic and state machines.
• Embedded Memory Includes approximately 4.94 Mbits of embedded memory for buffering, FIFOs, and on-chip data storage.
• I/O Density Offers 576 I/O pins to support wide parallel buses, multiple interfaces, and high-channel-count connectivity.
• Package & Mounting Delivered in a 900-BBGA package (supplier device package: 900-FBGA, 31×31) for high pin-count, surface-mount PCB integration.
• Power Operates from a defined supply voltage range of 1.14 V to 1.26 V to meet tight power delivery and signal-level requirements.
• Temperature & Grade Rated for industrial use with an operating range of −40 °C to 100 °C.
• Compliance RoHS status: Compliant, supporting regulatory-driven assembly and manufacturing requirements.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded memory to implement custom datapaths, protocol processing, or hardware acceleration functions.
• Multi-channel I/O systems — Leverage 576 I/O pins for systems requiring many parallel interfaces, sensor arrays, or multiport connectivity.
• Industrial control — The industrial grade rating and −40 °C to 100 °C operating range enable deployment in automation and control equipment with defined environmental requirements.
• Custom interface bridging — Combine abundant logic and on-chip memory to create protocol converters, bus bridges, or specialized interface controllers.

Unique Advantages

• High logic capacity: 147,443 logic elements allow implementation of substantial custom digital architectures without external logic expansion.
• Significant embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces the need for external memory in many buffering and data-path applications.
• Extensive I/O resources: 576 I/O pins simplify routing for multiport designs and reduce dependence on external multiplexing.
• Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployments in temperature-varied environments.
• High pin-count BGA package: The 900-BBGA / 900-FBGA (31×31) package supports dense, surface-mount integration for compact boards.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose XC6SLX150-3FGG900I?

The XC6SLX150-3FGG900I positions itself for designs that require a balance of high logic density, substantial embedded memory, and large I/O capability within an industrial-grade FPGA package. Its defined voltage and temperature ranges make it suitable for engineers specifying predictable power and thermal operating points.

This device is appropriate for teams building complex custom digital logic, multi-channel interface systems, or industrial control solutions that benefit from on-chip resources and a high pin-count BGA footprint. Its feature set provides a clear path for scalable hardware designs where integration and reliability are priorities.

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