XC6SLX150-3FGG676C

The XC6SLX150-3FGG676C is a Spartan®-6 LX field programmable gate array (FPGA) in a 676-ball BGA package. It provides a high logic element count and a substantial amount of embedded memory, delivering integration for designs that require dense digital logic and significant on-chip RAM.

This device is commercial grade, surface-mount packaged, and operates over a core supply range of 1.14 V to 1.26 V and an ambient temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard commercial electronics applications.

Key Features

• Logic Capacity  147,443 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 4.94 Mbits of embedded memory for on-chip data buffering and storage.
• I/O Density  498 user I/Os to support multiple interfaces and parallel connectivity.
• Package & Mounting  676-BGA package (supplier device package: 676-FBGA, 27×27) with surface-mount mounting for compact board designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power architectures.
• Operating Environment  Commercial grade device rated for 0 °C to 85 °C ambient operation.

Typical Applications

• High-density digital logic  Implements complex FPGA logic functions where large logic element counts are required.
• Memory-centric designs  Leverages approximately 4.94 Mbits of embedded memory for buffering, FIFOs, and on-chip data storage.
• Multi-interface systems  Supports systems needing a high number of I/Os for parallel interfaces, peripheral aggregation, or protocol bridging.

Unique Advantages

• High logic density: 147,443 logic elements enable more functionality on a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM supports data buffering and reduces reliance on external memory.
• Extensive I/O: 498 user I/Os allow flexible connectivity to sensors, peripherals, and external interfaces.
• Compact BGA footprint: 676-FBGA (27×27) packaging balances pin count with board space efficiency for dense designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial applications and environments.

Why Choose XC6SLX150-3FGG676C?

The XC6SLX150-3FGG676C positions itself as a high-density, commercially rated FPGA solution for designers who need substantial logic resources, embedded memory, and broad I/O capability in a compact BGA package. Its combination of 147,443 logic elements, approximately 4.94 Mbits of on-chip RAM, and 498 I/Os makes it well suited to complex digital designs and multi-interface systems.

For teams focused on integration and reduced system complexity, this Spartan®-6 LX device delivers scalable logic and memory resources with clear electrical and thermal parameters to plan around, supporting robust design and procurement decisions.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the XC6SLX150-3FGG676C. Provide your required quantities and lead-time needs to get a formal quote tailored to your project.