XC6SLX150-3FGG900C

The XC6SLX150-3FGG900C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded designs. It provides a large programmable fabric with 147,443 logic elements and approximately 4.94 Mbits of embedded memory, alongside 576 I/O pins to support complex interfacing requirements.

Packaged in a 900-ball BGA (supplier package: 900-FBGA, 31×31) and specified for operation from 0 °C to 85 °C, this surface-mount device is intended for commercial applications that require significant logic capacity, on-chip memory, and dense I/O in a compact package.

Key Features

• Logic Capacity — 147,443 logic elements provide substantial programmable resources for implementing combinational and sequential logic, custom datapaths, and control logic.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
• I/O Density — 576 available I/O pins to accommodate multiple high-density interfaces and parallel connections.
• Package and Mounting — 900-BBGA package (900-FBGA, 31×31) in a surface-mount form factor for compact board layouts and high pin-count routing.
• Power — Operates from a core supply range of 1.14 V to 1.26 V.
• Temperature and Grade — Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement control logic, protocol conversion, and custom processing blocks where substantial logic and memory are required.
• Communications and networking equipment — Support packet buffering, interface bridging, and I/O aggregation using the device’s high I/O count and on-chip RAM.
• High-density interface controllers — Serve as a hub for multiple parallel or serial interfaces in compact, surface-mount designs.
• FPGA-based prototyping and development — Provide a large, programmable fabric for validating designs and developing complex logic before production.

Unique Advantages

• Substantial logic resources: 147,443 logic elements enable implementation of large or multiple concurrent functions within a single device, reducing system complexity.
• On-chip memory capacity: Approximately 4.94 Mbits of embedded RAM lowers dependence on external memory for buffering and local storage.
• High I/O pin count: 576 I/O pins support extensive connectivity options for interfacing with peripherals and multiple subsystems.
• Compact, high-density package: 900-BBGA (900-FBGA, 31×31) provides a high pin count in a space-efficient, surface-mount footprint for dense board designs.
• Commercial temperature rating: Specified for 0 °C to 85 °C to match a wide range of standard commercial applications.
• RoHS compliance: Meets environmental requirements for lead-free assembly.

Why Choose XC6SLX150-3FGG900C?

The XC6SLX150-3FGG900C combines large programmable logic capacity, substantial embedded memory, and extensive I/O in a compact 900‑ball BGA package, making it well suited for commercial designs that require high integration within a surface-mount form factor. Its supply voltage range and commercial temperature specification align it with typical commercial embedded and communications applications.

Backed by AMD, this Spartan®-6 LX FPGA offers a balance of logic, memory, and I/O resources for engineers seeking to consolidate functionality, reduce external components, and accelerate development for commercial products.

Request a quote or submit a sales inquiry for pricing, availability, and lead-time information for the XC6SLX150-3FGG900C.