XC6SLX150-L1FGG484I

IC FPGA 338 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 338 4939776 147443 484-BBGA

Quantity 273 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O338Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150-L1FGG484I – Spartan®-6 LX FPGA, 484-BBGA

The XC6SLX150-L1FGG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 484-ball BGA package. It is a surface-mount, industrial-grade programmable logic device with high logic capacity and a broad operating temperature range for demanding environments.

Designed to deliver substantial on-chip memory, large I/O count and low-voltage core operation, this device targets applications that require significant programmable logic, flexible I/O connectivity and robust thermal performance.

Key Features

  • Logic Capacity — 147,443 logic elements to support complex digital designs and sizeable custom logic implementations.
  • Embedded Memory — Approximately 4.94 Mbits of embedded RAM for on-chip data buffering, FIFOs and state storage.
  • I/O Count — 338 user I/O pins to accommodate dense interfacing and multi-channel connectivity.
  • Power — Core voltage supply range from 1.14 V to 1.26 V for low-voltage operation.
  • Package & Mounting — 484-BBGA package case; supplier device package listed as 484-FBGA (23×23); surface-mount device for compact board integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support industrial applications.
  • Regulatory — RoHS compliant.
  • Manufacturer — AMD.

Unique Advantages

  • High logic density: 147,443 logic elements provide the resources needed for complex logic, parallel processing and system integration on a single device.
  • Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage tasks.
  • Extensive I/O capability: 338 I/O pins enable broad system connectivity and support for multiple interfaces and peripherals without external expanders.
  • Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh and temperature-variable environments.
  • Compact surface-mount packaging: 484-BBGA / 484-FBGA (23×23) footprint enables dense PCB layouts while maintaining thermal and signal integrity for high-pin-count designs.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-power system rails.

Why Choose XC6SLX150-L1FGG484I?

This Spartan‑6 LX FPGA combines high logic element count, significant embedded memory and a large number of I/O pins in a compact BGA package, making it suitable for designs that demand substantial programmable logic and flexible interfacing within industrial temperature ranges. Its surface-mount 484-ball package supports space-conscious board designs while providing the connectivity required for complex systems.

The device is well suited for engineering teams and procurement looking for an industrial-grade, RoHS-compliant FPGA from AMD that balances logic capacity, on-chip RAM and I/O density for mid- to high-complexity embedded applications.

Request a quote or submit your inquiry to sales to discuss pricing, availability and volume options for the XC6SLX150-L1FGG484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up