XC6SLX150-L1FGG484I
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 338 4939776 147443 484-BBGA |
|---|---|
| Quantity | 273 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 338 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11519 | Number of Logic Elements/Cells | 147443 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX150-L1FGG484I – Spartan®-6 LX FPGA, 484-BBGA
The XC6SLX150-L1FGG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 484-ball BGA package. It is a surface-mount, industrial-grade programmable logic device with high logic capacity and a broad operating temperature range for demanding environments.
Designed to deliver substantial on-chip memory, large I/O count and low-voltage core operation, this device targets applications that require significant programmable logic, flexible I/O connectivity and robust thermal performance.
Key Features
- Logic Capacity — 147,443 logic elements to support complex digital designs and sizeable custom logic implementations.
- Embedded Memory — Approximately 4.94 Mbits of embedded RAM for on-chip data buffering, FIFOs and state storage.
- I/O Count — 338 user I/O pins to accommodate dense interfacing and multi-channel connectivity.
- Power — Core voltage supply range from 1.14 V to 1.26 V for low-voltage operation.
- Package & Mounting — 484-BBGA package case; supplier device package listed as 484-FBGA (23×23); surface-mount device for compact board integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support industrial applications.
- Regulatory — RoHS compliant.
- Manufacturer — AMD.
Unique Advantages
- High logic density: 147,443 logic elements provide the resources needed for complex logic, parallel processing and system integration on a single device.
- Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage tasks.
- Extensive I/O capability: 338 I/O pins enable broad system connectivity and support for multiple interfaces and peripherals without external expanders.
- Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh and temperature-variable environments.
- Compact surface-mount packaging: 484-BBGA / 484-FBGA (23×23) footprint enables dense PCB layouts while maintaining thermal and signal integrity for high-pin-count designs.
- Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-power system rails.
Why Choose XC6SLX150-L1FGG484I?
This Spartan‑6 LX FPGA combines high logic element count, significant embedded memory and a large number of I/O pins in a compact BGA package, making it suitable for designs that demand substantial programmable logic and flexible interfacing within industrial temperature ranges. Its surface-mount 484-ball package supports space-conscious board designs while providing the connectivity required for complex systems.
The device is well suited for engineering teams and procurement looking for an industrial-grade, RoHS-compliant FPGA from AMD that balances logic capacity, on-chip RAM and I/O density for mid- to high-complexity embedded applications.
Request a quote or submit your inquiry to sales to discuss pricing, availability and volume options for the XC6SLX150-L1FGG484I.

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