XC6SLX150-N3FG484I

The XC6SLX150-N3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides a programmable logic fabric with a high logic element count, embedded memory, and a large number of I/O pins in a compact 484-BBGA package.

Designed for industrial-grade applications, this device targets designs that require significant programmable logic capacity, substantial on-chip RAM, and operating range suitable for industrial environments.

Key Features

• Logic Capacity  147,443 logic elements provide substantial programmable logic resources for complex custom logic and parallel processing designs.
• Configurable Logic Blocks  A logic fabric comprising 11,519 CLBs to structure combinational and sequential logic efficiently.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources  338 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power  Core supply range of 1.14 V to 1.26 V for the device core voltage domain.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
• Temperature Grade  Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Implement custom control logic, interfacing and real-time processing within industrial equipment using the industrial temperature rating and substantial logic resources.
• Embedded Systems  Integrate custom digital functions, protocol bridging, and peripheral control in compact boards using the 484-BBGA package and 338 I/O pins.
• Custom Signal Processing  Deploy parallel processing blocks and on-chip RAM for buffering and low-latency data paths in signal processing tasks.

Unique Advantages

• High logic density: 147,443 logic elements enable complex, highly parallel designs without immediate need for multiple devices.
• Significant on-chip RAM: Approximately 4.94 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O count: 338 I/O pins allow broad connectivity to sensors, peripherals, and external interfaces.
• Industrial temperature capability: −40 °C to 100 °C operation supports deployments in harsh and industrial environments.
• Compact surface-mount package: 484-BBGA (484-FBGA, 23×23) offers a space-efficient footprint for dense board designs.
• Regulatory compliance: RoHS compliance supports environmentally conscious assembly and procurement requirements.

Why Choose XC6SLX150-N3FG484I?

The XC6SLX150-N3FG484I balances high logic capacity, embedded memory, and extensive I/O in a compact, industrial-grade package, making it well suited for engineers building advanced programmable logic solutions. Its combination of 147,443 logic elements, approximately 4.94 Mbits of on-chip RAM, and 338 I/Os supports complex custom digital designs while accommodating robust temperature requirements.

Manufactured by AMD, this Spartan®-6 LX device addresses designs that require a reliable, scalable FPGA building block with a known footprint and power domain. It is appropriate for teams focused on industrial and embedded applications where integration density and environmental robustness are important considerations.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX150-N3FG484I and to discuss how it fits your next design.