XC6SLX150-N3FGG676C

The XC6SLX150-N3FGG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 676-ball BGA package. It combines high logic capacity and embedded memory with a large I/O count in a compact surface-mount package for commercial temperature range applications.

Designed for implementations that require substantial on-chip logic and buffering, this device delivers 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 498 user I/Os while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Core Logic  147,443 logic elements provide substantial capacity for custom digital designs and complex logic integration.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density  498 user I/Os enable broad connectivity for interfacing with peripherals, sensors, and high-pin-count systems.
• Package and Mounting  676-ball BGA (676-FBGA, 27×27) surface-mount package provides a high-density footprint for space-constrained PCBs.
• Power  Core supply voltage range of 1.14 V to 1.26 V allows precise power provisioning for the FPGA core.
• Temperature Grade  Commercial operating temperature range from 0°C to 85°C suitable for standard commercial applications.
• Regulatory/Environmental  RoHS compliant.

Typical Applications

• Embedded Systems  Use as a central programmable fabric for custom control logic, protocol bridging, and system glue in embedded platforms.
• Communications & Networking  High I/O count and on-chip memory support interface bridging, packet buffering, and custom protocol implementation.
• Industrial Control  Implements real-time logic, signal routing, and aggregation functions for non-automotive commercial control systems.
• Video and Data Processing  On-chip RAM and abundant logic elements enable localized data buffering and parallel processing pipelines for moderate-throughput applications.

Unique Advantages

• High Logic Capacity: 147,443 logic elements enable integration of large or multiple functions into a single FPGA, reducing external component count.
• Generous On-Chip Memory: Approximately 4.94 Mbits of embedded RAM supports data buffering and local storage without immediate reliance on external memory.
• Extensive I/O Resources: 498 user I/Os provide flexibility for dense peripheral connectivity and multi-interface designs.
• Compact, High-Density Package: 676-BGA (27×27) allows high pin count in a compact footprint, aiding PCB space optimization.
• Commercial Temperature Suitability: Rated 0°C to 85°C for reliable operation in standard commercial environments.
• Environmentally Compliant: RoHS compliance eases integration into products targeting regulated markets.

Why Choose XC6SLX150-N3FGG676C?

The XC6SLX150-N3FGG676C positions itself as a capable, high-capacity FPGA solution for commercial embedded and system-level designs that require substantial logic, on-chip memory, and broad I/O connectivity in a single device. Its combination of 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 498 I/Os in a 676-BGA package makes it well suited to consolidate multiple functions and reduce overall BOM complexity.

From prototyping to production for commercial-temperature products, this AMD Spartan®-6 LX device delivers a balanced mix of integration, connectivity, and package density to support scalable, robust designs.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the XC6SLX150-N3FGG676C.