XC6SLX150-N3FGG676I

The XC6SLX150-N3FGG676I is an AMD Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 676-BGA (676-FBGA, 27×27) package, supplied as a surface-mount IC and rated for industrial use. It provides a high-density programmable logic fabric with 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 498 user I/Os for complex, I/O‑rich designs.

Designed for applications that require substantial on-chip logic and memory within a compact BGA footprint, this device operates from a core voltage range of 1.14 V to 1.26 V and is specified for operation from -40 °C to 100 °C. The part is RoHS compliant.

Key Features

• Core Logic 147,443 logic elements provide a large programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, local data storage, and memory-intensive logic tasks.
• I/O Density 498 user I/Os enable high connectivity for sensor interfaces, external memory, and peripheral integration.
• Package and Mounting 676-FBGA (27×27) package in a surface-mount format offers a compact, high-pin-count solution for space-constrained boards.
• Power Core supply voltage range of 1.14 V to 1.26 V for compatibility with standard FPGA power rails.
• Operating Range Industrial operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant to support regulatory requirements for hazardous substance reduction.

Typical Applications

• Industrial Control — Use the wide operating temperature and high I/O count for sensor interfacing, motor control logic, and real-time control functions.
• High‑Density Logic Implementations — Large logic element count in a compact BGA package supports complex state machines, protocol bridges, and custom processing pipelines.
• Memory‑Heavy Embedded Designs — Approximately 4.94 Mbits of embedded RAM provides local storage for buffering, FIFOs, and temporary data structures.

Unique Advantages

• High Logic Capacity: 147,443 logic elements enable implementation of large, integrated digital designs without external ASICs.
• Significant On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for many data paths and buffering needs.
• Extensive I/O: 498 user I/Os offer flexibility for interfacing multiple peripherals, sensors, and I/O standards on a single device.
• Industrial Temperature Rating: Specified operation from -40 °C to 100 °C supports deployment in demanding thermal environments.
• Compact, High‑Pin Package: 676-FBGA (27×27) delivers a high pin count in a space-efficient form factor for dense board layouts.
• Regulatory Compliance: RoHS compliance aids environmental and supply-chain requirements.

Why Choose XC6SLX150-N3FGG676I?

The XC6SLX150-N3FGG676I positions itself as a robust, high-density FPGA choice for designs that require substantial programmable logic, on-chip memory, and a large number of I/Os in a compact industrial-grade package. Its combination of logic capacity, embedded RAM, and a 676-FBGA footprint makes it suitable for engineering teams seeking to consolidate functions and reduce external component count.

For projects where temperature resilience, I/O flexibility, and integrated memory are key, this Spartan®-6 LX device delivers a balanced platform backed by AMD's FPGA family ecosystem and documentation.

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