XC6SLX150-N3FGG900I

The XC6SLX150-N3FGG900I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC offering a large logic fabric and flexible I/O in a 900-ball BGA package. It provides 147,443 logic elements, 11,519 configurable logic blocks (CLBs), and 576 I/Os, making it suitable for complex programmable-logic designs that require substantial on-chip resources.

With approximately 4.94 Mbits of embedded memory and a specified supply voltage range of 1.14 V to 1.26 V, this industrial-grade device supports deployment across a wide operating temperature range from −40°C to 100°C while maintaining a surface-mount footprint in a 900-FBGA (31×31) supplier device package.

Key Features

• Core Architecture Spartan®-6 LX FPGA family provides a programmable logic platform implemented in a 900-ball BGA package.
• Logic Capacity 147,443 logic elements and 11,519 CLBs for implementing large-scale logic functions and complex control algorithms.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and memory-mapped logic structures.
• I/O Count 576 I/Os to support wide parallel interfaces and numerous peripheral connections directly from the FPGA.
• Power Supply Specified operating voltage range of 1.14 V to 1.26 V for core power domains.
• Package & Mounting Surface-mount 900-BBGA package, supplier device package 900-FBGA (31×31), for compact board-level integration.
• Industrial Operating Range Rated for operation from −40°C to 100°C for use in temperature-demanding environments.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• High logic density: 147,443 logic elements deliver capacity for complex designs without external logic expansion.
• Large I/O complement: 576 I/Os allow direct interfacing to multiple peripherals and high-channel-count systems.
• On-chip memory availability: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Industrial temperature support: −40°C to 100°C rating enables deployment in thermally challenging or outdoor applications.
• Compact BGA footprint: 900-FBGA (31×31) package offers a balance of pin count and board space for dense designs.
• Controlled core supply range: Narrow 1.14 V to 1.26 V voltage specification supports predictable power design.

Why Choose XC6SLX150-N3FGG900I?

The XC6SLX150-N3FGG900I positions itself as a robust, high-capacity Spartan®-6 LX FPGA option for engineers who need substantial logic resources, abundant I/Os, and on-chip memory within a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployments where environmental range and regulatory status matter.

This device is well suited to designs that require scalable programmable logic, extensive peripheral interfacing, and integrated memory buffers while maintaining a predictable power envelope and compact surface-mount packaging.

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