XC6SLX150-N3FGG484C

The XC6SLX150-N3FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, supplied in a 484-BBGA surface-mount package. It provides substantial on-chip resources and I/O density for commercial-grade FPGA designs operating within a 0 °C to 85 °C temperature range.

Key architectural attributes include 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 338 user I/O pins, all optimized for low-voltage operation across a 1.14 V to 1.26 V supply window.

Key Features

• Logic Capacity  147,443 logic elements provide large-scale programmable logic integration for complex digital designs.
• On‑Chip Memory  Approximately 4.94 Mbits of embedded RAM support buffer, FIFO and state storage requirements without external memory.
• I/O Density  338 user I/O pins enable extensive interfacing to peripherals, buses and external devices.
• Power  Operates from a low-voltage supply range of 1.14 V to 1.26 V to match modern system rail requirements.
• Package and Mounting  484-BBGA (supplier package: 484-FBGA 23×23) in a surface-mount form factor for compact PCB implementations.
• Temperature and Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, meeting standard lead-free requirements for commercial electronic assemblies.

Typical Applications

• FPGA development and prototyping  Use the device where significant on-chip logic and memory resources are required in a commercial development environment.
• Embedded systems integration  Suitable for designs that require up to 338 I/O connections and substantial embedded RAM without immediate reliance on external memory.
• Compact board designs  The 484-BBGA surface-mount package supports high-density PCB layouts while maintaining a large logic and I/O footprint.
• Low-voltage systems  Designed for systems operating on a 1.14 V to 1.26 V supply rail within commercial temperature limits.

Unique Advantages

• High logic integration: 147,443 logic elements enable consolidation of complex functions into a single device, reducing component count.
• Significant embedded memory: Approximately 4.94 Mbits of on-chip RAM minimizes dependence on external memory for many buffering and storage needs.
• Extensive I/O capability: 338 user I/O pins provide flexibility for multi‑channel interfaces and dense peripheral connectivity.
• Compact package footprint: 484-BBGA (23×23 FBGA) surface-mount package supports compact PCB designs while delivering high density.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements for mainstream electronic products.
• Low-voltage operation: Narrow supply range (1.14 V–1.26 V) suited to modern low-voltage system architectures.

Why Choose XC6SLX150-N3FGG484C?

The XC6SLX150-N3FGG484C balances large logic capacity, substantial embedded memory and high I/O count in a compact 484-BBGA surface-mount package, making it well suited for commercial FPGA designs that require dense integration on space-constrained PCBs. Its low-voltage supply range and RoHS compliance align with contemporary system and regulatory needs.

This device is a fit for engineers and procurement teams seeking a commercially graded Spartan®-6 LX FPGA with measurable on-chip resources, clear thermal and supply specifications, and a surface-mount package for production-ready assemblies.

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