XC6SLX150-N3FG484C

The XC6SLX150-N3FG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity, substantial on‑chip memory, and broad I/O connectivity in a surface-mount 484-BBGA package for commercial-temperature applications.

This device is intended for designs that require configurable digital logic, embedded memory resources, and a large number of I/O connections while operating within a 0 °C to 85 °C temperature range and a 1.14 V to 1.26 V supply window.

Key Features

• Logic Capacity — 11519 CLBs and 147,443 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM available for buffering, lookup tables, and state storage.
• I/O Density — 338 user I/O pins to support extensive peripheral and subsystem interfacing.
• Power Supply — Operates from a defined core voltage range of 1.14 V to 1.26 V to match system power design.
• Package & Mounting — Supplied in a 484-BBGA (supplier package: 484-FBGA, 23 × 23) surface-mount package for compact PCB integration.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant for regulated material requirements.

Typical Applications

• Custom Digital Logic — Implement application-specific processing and control functions using the device’s large logic fabric.
• Memory-Intensive Processing — Leverage approximately 4.94 Mbits of embedded RAM for data buffering, packet handling, or LUT-based functions.
• High-Density I/O Systems — Connect multiple peripherals, sensors, or interfaces using 338 available I/O pins.
• Compact PCB Designs — Surface-mount 484-BBGA package enables dense board layouts where board space is constrained.

Unique Advantages

• High Logic Density: 147,443 logic elements and 11,519 CLBs provide the resources to implement complex logic and state machines on a single device.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of RAM reduce reliance on external memory for many buffering and lookup needs.
• Extensive I/O Connectivity: 338 I/O pins enable flexible interfacing to multiple subsystems without additional bridging components.
• Compact, PCB‑Friendly Package: 484-BBGA (23 × 23) surface-mount package supports space-efficient board designs and high pin counts.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet standard commercial deployment conditions.
• RoHS Compliant: Conforms to material restrictions for environmentally conscious designs.

Why Choose XC6SLX150-N3FG484C?

The XC6SLX150-N3FG484C balances high logic and memory capacity with broad I/O and a compact package, making it a practical choice for developers requiring programmable logic and embedded memory within commercial-temperature electronics. Its defined supply range and surface-mount 484-BBGA footprint simplify integration into modern PCB designs.

This AMD Spartan®-6 LX FPGA is suited to teams building scalable, logic‑intensive systems that need on‑device RAM and significant I/O capability, while maintaining RoHS compliance and commercial-grade operating characteristics.

Request a quote or submit a pricing inquiry for the XC6SLX150-N3FG484C to begin integrating this Spartan®-6 LX FPGA into your next design.