XC6SLX150-N3FG900I

The XC6SLX150-N3FG900I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD offered in a 900-ball BGA package. It delivers a high density of programmable logic, on-chip memory and I/O resources suited for industrial applications and embedded designs that require a flexible hardware implementation.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 576 I/O pins, this device provides a balance of integration and I/O capability while supporting a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  147,443 logic elements provide substantial programmable logic capacity for custom digital functions and hardware acceleration.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and small data stores directly in the FPGA fabric.
• I/O Resources  576 I/O pins to accommodate wide parallel interfaces, multiple peripherals, or dense connector requirements.
• Power  Specified supply voltage range of 1.14 V to 1.26 V for the core to guide power-supply design and integration.
• Package & Mounting  900-BBGA package (supplier device package: 900-FBGA (31x31)) with surface-mount mounting for compact board-level implementation.
• Temperature & Grade  Industrial-grade device rated for an operating temperature range of −40 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Automation  Use the industrial temperature rating and extensive I/O count to interface sensors, actuators, and control networks in factory and process automation equipment.
• Embedded Systems  Leverage the large logic capacity and embedded memory for custom logic, protocol handling, or hardware acceleration in embedded designs.
• Data Acquisition & I/O Expansion  High I/O density and on-chip RAM support buffering and aggregation of multiple input/output streams for measurement and monitoring systems.
• Prototyping and Custom Logic  Provision programmable resources for hardware prototyping, algorithm offload, and application-specific logic implementation.

Unique Advantages

• Substantial Logic Capacity: 147,443 logic elements enable complex designs and parallel processing without immediate need for external logic expansion.
• On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduce dependence on external memory for many buffering and temporary storage needs.
• High I/O Count: 576 I/O pins simplify board-level connectivity and reduce the need for additional interface ICs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
• Compact Surface-Mount Package: 900-BBGA (900-FBGA (31x31)) allows high-density PCB layouts while maintaining robust package-level integration.
• RoHS Compliant: Meets common environmental compliance requirements for modern electronic assemblies.

Why Choose XC6SLX150-N3FG900I?

The XC6SLX150-N3FG900I positions itself as a capable, industrial-grade FPGA option for designers who require a large programmable fabric, significant embedded memory, and extensive I/O in a compact BGA package. Its specification set supports a range of embedded and industrial applications where integration, configurability, and thermal robustness are important.

This device is well suited to teams building custom logic, I/O-intensive systems, and embedded controllers that benefit from an FPGA-based approach—providing scalability of functionality within a single, RoHS-compliant device footprint.

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