XC6SLX150-N3FG900C

The XC6SLX150-N3FG900C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC designed for commercial-grade programmable logic applications. It delivers high logic density and substantial on-chip memory in a compact 900-BBGA package.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 576 user I/Os, this device is suited to commercial embedded systems and I/O-intensive designs that require integration of dense digital logic with flexible interfacing. The device operates from a 1.14 V to 1.26 V supply and is specified for 0 °C to 85 °C operation.

Key Features

• Core Capacity — 147,443 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic functions.
• I/O Density — 576 user I/O pins to accommodate high-channel-count interfacing and multiport connectivity.
• Power — Operates from a 1.14 V to 1.26 V supply, enabling designs with defined supply requirements.
• Package & Mounting — 900-BBGA (supplier device package: 900-FBGA, 31×31) in a surface-mount form factor for compact board integration.
• Commercial Grade Temperature Range — Specified for 0 °C to 85 °C operation for commercial applications.
• RoHS Compliant — Meets environmental compliance requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Use the device to implement custom logic and control functions in commercial electronics where substantial logic capacity is required.
• I/O-Intensive Interface Hubs — 576 I/Os support high-channel-count interfaces, protocol bridging, and multiport connectivity tasks.
• Memory-Dependent Logic — Approximately 4.94 Mbits of on-chip RAM enable buffering, packet handling, and stateful processing within the FPGA fabric.
• High-Density Logic Consolidation — Large logic element count enables consolidation of multiple discrete functions into a single programmable device.

Unique Advantages

• High Logic Density: 147,443 logic elements allow implementation of complex custom logic without external ASICs, reducing overall system BOM.
• Substantial Embedded Memory: Approximately 4.94 Mbits of on-chip RAM minimizes external memory needs for many buffering and control tasks.
• Extensive I/O Count: 576 user I/Os provide flexibility for multi-channel interfaces, sensor arrays, and parallel connectivity.
• Compact Surface-Mount Package: 900-BBGA (31×31) supports space-constrained PCB designs while delivering large resource counts.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation matches typical commercial deployment environments.
• RoHS Compliant: Facilitates lead-free manufacturing and compliance with common environmental regulations.

Why Choose XC6SLX150-N3FG900C?

The XC6SLX150-N3FG900C positions itself as a high-capacity, commercial-grade FPGA that balances large-scale programmable logic, significant on-chip memory, and extensive I/O in a compact surface-mount package. Its defined voltage range and commercial temperature spec make it appropriate for production embedded designs where integration and density matter.

This device is well suited for engineering teams consolidating multiple functions into a single programmable device, building I/O-rich interface systems, or deploying memory-dependent logic on a commercial platform. Its combination of resources offers scalability for designs that require substantial logic and connectivity while maintaining a standard commercial qualification and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX150-N3FG900C and to discuss how it can fit into your next commercial FPGA design.