XC6SLX150-N3CSG484I

The XC6SLX150-N3CSG484I is a Spartan®-6 LX field programmable gate array (FPGA) IC designed for programmable logic applications requiring substantial logic capacity and on-chip memory. It combines a high count of logic elements with embedded RAM and a large I/O complement in a compact 484-CSPBGA package for surface-mount assembly.

Targeted at industrial-grade deployments, this device operates across a wide temperature range and runs from a low-voltage core supply, offering designers deterministic control over system-level integration and I/O count for medium- to high-density FPGA implementations.

Key Features

• Core Logic Capacity — Provides 147,443 logic elements to support complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Density — 338 user I/Os to accommodate a wide range of parallel interfaces and signal requirements.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting — Supplied in a 484-CSPBGA (19×19) / 484-FBGA package, designed for surface-mount assembly in compact PCB footprints.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of feature-rich designs without immediate need for multiple devices.
• On-chip memory capacity: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for temporary storage and buffering.
• Generous I/O count: 338 I/Os provide flexibility to interface with multiple peripherals, sensors, or parallel buses directly.
• Industrial readiness: Specified operating range of −40 °C to 100 °C supports deployment in industrial environments.
• Compact, manufacturable package: 484-CSPBGA (19×19) package offers a small PCB footprint while supporting surface-mount processes.
• Regulatory alignment: RoHS compliance simplifies integration into lead-free manufacturing flows.

Why Choose XC6SLX150-N3CSG484I?

The XC6SLX150-N3CSG484I delivers a balance of logic capacity, embedded memory, and I/O density in an industrial-grade FPGA package. Its combination of approximately 147k logic elements, nearly 5 Mbits of on-chip RAM, and 338 I/Os makes it suitable for mid- to high-density programmable logic tasks where integration and I/O count are critical.

Choosing this device supports designs that require robust temperature performance, compact assembly in a 484-CSPBGA footprint, and alignment with RoHS requirements—offering predictable scalability and practical integration for production-oriented FPGA solutions.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX150-N3CSG484I and to discuss how it fits your next programmable logic design.