XC6SLX150-L1FG484I

The XC6SLX150-L1FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD in a 484-ball BGA package. It provides a substantial logic capacity and on-chip memory with a broad industrial operating range and surface-mount packaging to support demanding embedded designs.

This device is targeted at designs that require a high count of logic elements, significant embedded RAM, and a large number of I/O pins while operating across an industrial temperature range and with low-voltage core supply requirements.

Key Features

• Logic Capacity  147,443 logic elements (cells) provide substantial programmable logic resources for complex digital designs.
• Configurable Logic Blocks (CLBs)  11,519 CLBs enable dense implementation of custom logic functions within the Spartan‑6 LX architecture.
• On‑Chip Memory  Approximately 4.94 Mbits of embedded memory to support buffering, state storage, and data manipulation without external RAM.
• I/O Count  338 user I/O pins for flexible interfacing to peripherals, sensors, and external devices.
• Package and Mounting  484‑BBGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for compact board integration.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V to match platform power constraints and standard FPGA core rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support industrial-grade thermal environments.
• RoHS Compliant  Conforms to RoHS requirements for lead‑free manufacturing and environmental compliance.

Unique Advantages

• High logic and memory density: Combines 147,443 logic elements with approximately 4.94 Mbits of embedded RAM to consolidate complex functions on a single device.
• Extensive I/O capability: 338 I/O pins simplify connectivity and allow direct interfacing to a wide range of external components without additional multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in a surface‑mount 484‑BBGA package suitable for industrial applications.
• Compact, board‑level integration: 484‑FBGA (23×23) supplier package offers a high pin count in a compact footprint for dense PCB layouts.
• Standards‑oriented supply: Low-voltage core operation (1.14–1.26 V) aligns with common FPGA power rails for predictable integration into existing power architectures.

Why Choose XC6SLX150-L1FG484I?

The XC6SLX150-L1FG484I positions itself as a high-capacity Spartan‑6 LX FPGA option for designs that demand large programmable logic resources, significant embedded RAM, and broad I/O capacity while operating in industrial temperature ranges. Its combination of logic elements, CLBs, and on‑chip memory enables consolidation of multiple functions into a single device, reducing board complexity.

Engineers and procurement teams looking for a robust FPGA solution with a compact 484‑BBGA footprint, RoHS compliance, and a well‑defined supply voltage and temperature specification will find the XC6SLX150-L1FG484I suitable for a range of embedded and industrial applications where predictable electrical and thermal characteristics are required.

Request a quote or submit a purchase inquiry to evaluate the XC6SLX150-L1FG484I for your next design.