XC6SLX150-L1CSG484I

IC FPGA 338 I/O 484CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 338 4939776 147443 484-FBGA, CSPBGA

Quantity 1,187 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGA, CSPBGANumber of I/O338Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150-L1CSG484I – Spartan®-6 LX FPGA, 484-CSPBGA (19×19)

The XC6SLX150-L1CSG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) provided in a 484-pin CSPBGA package. It delivers a high count of programmable logic and on-chip memory suited to dense, I/O-rich designs.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 338 I/O, this device targets applications that require substantial programmable logic capacity combined with broad external connectivity, while meeting industrial temperature requirements.

Key Features

  • Logic Capacity  Provides 147,443 logic elements for implementing complex programmable logic functions and parallel architectures.
  • Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage without external memory.
  • High I/O Count  338 user I/O pins support extensive external interfacing for sensors, peripherals, and high-pin-count systems.
  • Package & Mounting  Supplied in a 484-CSPBGA (19×19) package (484-FBGA, CSPBGA) designed for surface-mount assembly.
  • Power  Core supply range from 1.14 V to 1.26 V to meet specified power-domain requirements.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for designs requiring extended temperature capability.
  • Regulatory Compliance  RoHS-compliant construction supports environmental regulatory requirements.

Typical Applications

  • FPGA-Based System Integration  Use as the central programmable logic element for consolidating multiple digital functions and accelerating prototype development.
  • I/O-Intensive Control  Ideal for systems requiring large numbers of external connections, such as multi-channel data aggregation and interface bridging.
  • Embedded Memory-Dependent Designs  On-chip RAM supports buffering and temporary storage for stream processing and packet handling.
  • Industrial Electronics  Industrial-grade temperature rating and robust packaging make it suitable for equipment operating across extended temperature ranges.

Unique Advantages

  • High Logic Density: 147,443 logic elements enable implementation of large, complex logic functions and parallel datapaths within a single device, reducing system complexity.
  • Substantial On-Chip RAM: Approximately 4.94 Mbits of embedded memory reduces dependency on external RAM for many buffering and temporary storage needs.
  • Extensive I/O Accessibility: 338 I/O pins provide flexibility for connecting multiple peripherals, sensors, and communication interfaces without external I/O expansion.
  • Industrial Temperature Support: Operation from −40 °C to 100 °C supports deployment in equipment exposed to wide temperature ranges.
  • Compact CSPBGA Packaging: 484-CSPBGA (19×19) package delivers high pin count in a compact surface-mount form factor for space-constrained PCBs.
  • RoHS Compliance: Meets RoHS requirements for environmentally conscious designs.

Why Choose XC6SLX150-L1CSG484I?

The XC6SLX150-L1CSG484I positions itself as a high-capacity Spartan®-6 LX FPGA suitable for designs that demand substantial logic resources, embedded memory, and wide I/O capability within a compact CSPBGA footprint. Its industrial temperature rating and RoHS compliance support deployment in equipment requiring reliable operation across extended temperature ranges.

This device is appropriate for engineering teams and procurement seeking a scalable, programmable platform to consolidate digital functions, reduce board-level component counts, and address I/O-heavy system requirements while maintaining surface-mount assembly compatibility.

Request a quote or submit a purchase inquiry to evaluate availability and pricing for the XC6SLX150-L1CSG484I.

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