XC6SLX150T-2FG484I

The XC6SLX150T-2FG484I is a field-programmable gate array (FPGA) device delivered in a 484-ball BGA package. It provides a high logic capacity and embedded RAM while supporting a wide operating temperature range for industrial applications. Designed for systems that require substantial on-chip logic, memory resources and flexible I/O, this device balances integration and board-level density.

Key Features

• Core Logic — Contains 147,443 logic elements across 11,519 logic blocks, enabling implementation of large combinational and sequential logic designs.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support data buffering, state storage, and intermediate processing without external memory.
• I/O Capacity — 296 user I/O pins to accommodate multiple interfaces and high pin-count connectivity on a single device.
• Power Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V for predictable core power requirements.
• Package & Mounting — Supplied in a 484-BBGA package (supplier package: 484-FBGA, 23 × 23 mm) with surface-mount mounting type to support compact PCB layouts.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — High logic density and industrial temperature rating make it suitable for PLCs, motion controllers, and programmable automation modules requiring robust on-board processing.
• Communications & Networking — Large logic element count and abundant I/Os support protocol processing, packet handling, and I/O consolidation in network equipment.
• Embedded System Integration — On-chip RAM and extensive I/O enable data buffering and interface aggregation for embedded processing subsystems and custom peripheral integration.

Unique Advantages

• High integration of logic and routing: 147,443 logic elements enable complex designs to be implemented on a single device, reducing the need for multiple discrete components.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage tasks.
• Flexible system I/O: 296 I/O pins provide broad interface options, simplifying board-level routing and enabling integration of multiple peripherals.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to support deployment in temperature-demanding environments.
• Compact, manufacturable package: 484-BBGA (23 × 23 mm supplier package) surface-mount format supports high-density board designs and automated assembly.
• Regulatory compliance: RoHS compliance supports designs targeting restricted-substance requirements.

Why Choose XC6SLX150T-2FG484I?

The XC6SLX150T-2FG484I positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive on-chip logic, substantial embedded memory, and a large number of I/Os in a compact BGA package. Its specified core voltage range and industrial operating temperatures make it suitable for engineers building robust, long-lived systems that must operate across a wide temperature span.

This device is well suited to engineers and procurement teams looking for scalable logic resources and on-chip memory to consolidate functions, simplify board-level design, and maintain compliance with RoHS requirements.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XC6SLX150T-2FG484I.