XC6SLX150T-2FG676I

The XC6SLX150T-2FG676I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD, provided in a 676-ball BGA package. This device combines a high logic element count with substantial on-chip memory and a large I/O complement, and is offered in an industrial-grade variant for deployment across temperature-sensitive environments.

Designed for applications that require programmable logic, the device delivers a balance of integration and configurability with defined power and thermal operating ranges to support reliable system-level designs.

Key Features

• Logic Capacity  Approximately 147,443 logic elements enabling implementation of complex programmable logic functions.
• Configurable Logic Blocks  11,519 configurable logic blocks for fine-grained design partitioning and resource allocation.
• Embedded Memory  Approximately 4.94 Mbits of embedded memory for on-chip data buffering and state storage.
• I/O Resources  396 I/O pins to support broad interfacing options with external peripherals and subsystems.
• Power  Specified core voltage range from 1.14 V to 1.26 V for core power planning and regulator selection.
• Package  676-BGA package case; supplier device package listed as 676-FBGA (27x27) for compact, high-density mounting.
• Temperature Range  Industrial operating range from -40°C to 100°C for deployments in challenging environments.
• Mounting & Compliance  Surface mount device with RoHS compliance for standard PCB assembly and regulatory adherence.

Typical Applications

• Industrial Control  Industrial-grade temperature range and extensive I/O make this FPGA suitable for programmable logic in factory automation and control systems.
• Embedded Systems  High logic density and on-chip memory support custom embedded processing and glue-logic implementations.
• Signal Aggregation & I/O Expansion  Large I/O count enables aggregation, interface bridging, and custom peripheral support in complex electronic systems.

Unique Advantages

• High Logic Density: 147,443 logic elements provide the capacity to implement sophisticated custom logic and state machines.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded memory reduces reliance on external RAM for many designs.
• Extensive I/O: 396 I/O pins offer flexibility for interfacing with a wide range of external devices and subsystems.
• Industrial Operation: Specified -40°C to 100°C operating range supports deployment in temperature-demanding environments.
• Compact, High‑Density Package: 676-BGA / 676-FBGA (27x27) format enables high integration on space-constrained PCBs.
• Regulatory Compliance: RoHS-compliant construction aligns with common manufacturing and environmental requirements.

Why Choose XC6SLX150T-2FG676I?

The XC6SLX150T-2FG676I positions itself as a versatile Spartan-6 LXT FPGA option for designers who need significant logic capacity, embedded memory, and abundant I/O within an industrial-rated device. Its specified voltage and temperature ranges, together with a compact 676-ball BGA package, offer a clear technical basis for reliable system integration in demanding applications.

This device is well suited to teams developing custom programmable-logic solutions that require on-chip resources and an industrial operating envelope, providing a stable platform for scalable and robust designs supported by AMD's FPGA product family.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX150T-2FG676I.