XC6SLX150T-2FG676C

The XC6SLX150T-2FG676C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD, offered in a 676-ball BGA package. It combines high logic capacity and embedded memory with a large I/O complement for dense, programmable digital designs.

Designed for commercial-temperature applications, this surface-mount FPGA provides a balance of logic resources, on-chip RAM and flexible I/O in a compact 27×27 mm FBGA footprint, suitable for systems requiring significant programmable logic and memory on a single device.

Key Features

• Core Architecture: Spartan®-6 LXT FPGA family device from AMD, delivering programmable logic resources for custom digital implementations.
• Logic Capacity: 147,443 logic elements and 11,519 CLBs, providing substantial combinational and sequential resource density for complex logic functions.
• Embedded Memory: Approximately 4.94 Mbits of on-chip RAM for local buffering, lookup tables and state storage without external memory.
• I/O Resources: 396 user I/O pins to support multiple interfaces, peripherals and board-level connections.
• Package & Mounting: 676-ball FBGA (27×27) package, surface-mount mounting type to support compact PCB layouts.
• Power Supply: Core supply range of 1.14 V to 1.26 V; suitable for designs targeting this core voltage window.
• Operating Temperature: Commercial grade operation from 0 °C to 85 °C for typical commercial-environment deployments.
• Compliance: RoHS compliant, supporting lead-free assembly and regulatory requirements for hazardous substances.

Typical Applications

• High-density digital systems: Leverage the large logic element count to implement complex control and signal-processing functions on a single FPGA.
• I/O-intensive interfaces: Use the 396 I/O pins to consolidate multiple peripheral interfaces and board-level connections without external glue logic.
• Embedded buffering and state storage: Apply the approximately 4.94 Mbits of on-chip RAM for local data buffering, FIFOs and lookup storage to reduce external memory needs.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of large logic designs that would otherwise require multiple smaller devices.
• Ample embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependency on external memory components and simplifies board design.
• Extensive I/O count: 396 I/Os provide flexibility to interface with a wide range of peripherals and support complex system integration.
• Compact FBGA package: 676-ball, 27×27 FBGA footprint supports high-pin-count routing in a space-efficient form factor for dense PCBs.
• RoHS compliant: Designed for lead-free assembly to meet environmental and regulatory requirements.

Why Choose XC6SLX150T-2FG676C?

The XC6SLX150T-2FG676C positions itself as a commercially graded Spartan‑6 LXT FPGA that delivers a substantial mix of logic elements, embedded memory and I/O in a compact 676‑BGA package. It is well suited for designers who need to consolidate complex logic, buffering and interface functions into a single programmable device while maintaining a small board footprint.

With a clear set of electrical and mechanical specifications—core voltage range, operating temperature, package type and RoHS compliance—this FPGA offers predictable integration into commercial designs and supports straightforward PCB assembly and regulatory planning.

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