XC6SLX150T-2FG900I

The XC6SLX150T-2FG900I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC offered in a 900‑ball BGA package. Designed for industrial applications, it provides a large logic capacity, substantial embedded memory, high I/O count and a package suited for surface-mount assembly, supporting designs that require dense programmable logic in a compact form factor.

Key Features

• Logic Capacity — 147,443 logic elements and 11,519 logic blocks provide significant on-chip programmable logic for complex designs.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density — 540 user I/O pins for broad interfacing options with peripherals, sensors and external logic.
• Package and Mounting — 900‑BBGA (supplier package: 900‑FBGA, 31×31) in a surface-mount form factor for high-density board layouts.
• Power — Core supply voltage range from 1.14 V to 1.26 V to match low-voltage FPGA power domains.
• Operating Temperature — Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
• RoHS Compliance — Meets RoHS requirements for restricted hazardous substances.

Typical Applications

• Industrial Control Systems — Implement real-time control logic and state machines, leveraging the industrial temperature rating and wide I/O count for sensor and actuator interfaces.
• Embedded Signal Processing — Use the large logic element count and on-chip RAM for data buffering, filtering and custom processing pipelines in embedded devices.
• High‑Density I/O Interfaces — Aggregate and translate signals between multiple peripherals or subsystems using the 540 available I/O pins.
• Custom Hardware Acceleration — Offload compute- or logic-intensive functions to on-board programmable logic to tailor performance and reduce external components.

Unique Advantages

• Substantial Logic Resources: 147,443 logic elements enable implementation of large, complex designs without immediate migration to larger device families.
• Significant On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O Count: 540 user I/Os simplify integration with multiple peripherals and I/O standards while minimizing the need for external expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial and other temperature-challenging environments.
• Compact, High‑Density Package: 900‑ball BGA (31×31) supports high-density PCB routing while keeping component count and board area optimized.
• RoHS Compliant: Conforms to RoHS standards for reduced hazardous materials in manufacturing.

Why Choose XC6SLX150T-2FG900I?

The XC6SLX150T-2FG900I positions itself as a capable Spartan‑6 LXT FPGA for industrial designs that require a combination of large logic capacity, on-chip memory and a high I/O count in a compact BGA package. Its industrial temperature rating and surface-mount 900‑BBGA packaging make it suitable for embedded systems and control equipment where reliability and board-space efficiency matter.

Engineers seeking a programmable solution that balances logic density, embedded memory and extensive I/O for mid-to-high complexity designs will find this device aligned with those needs, offering a clear path for integration into industrial and embedded applications.

Request a quote or submit an inquiry for the XC6SLX150T-2FG900I to evaluate its fit for your next design or production run.