XC6SLX150T-2FGG676I

The XC6SLX150T-2FGG676I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 676-BGA package. It provides a high-density programmable logic fabric with integrated memory and extensive I/O in a surface-mount FBGA footprint.

With approximately 147,443 logic elements, roughly 4.94 Mbits of embedded RAM and 396 I/O, this industrial-grade device is specified for operation from −40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V, supporting designs that require substantial on-chip resources and robust operating margins.

Key Features

• Core Logic — Approximately 147,443 logic elements for implementing complex, custom digital functions on-chip.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffers, FIFOs and localized data storage without immediate reliance on external memory.
• I/O Capacity — 396 user I/O pins to enable broad interfacing to peripherals, sensors and external devices.
• Power — Core voltage supply specified from 1.14 V to 1.26 V to match system power architectures.
• Package & Mounting — 676-FBGA (27×27) package case in a surface-mount form factor for high pin-count board designs.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Compliance — RoHS compliant to meet common environmental directives for lead-free assembly.

Typical Applications

• Industrial Control — FPGA-based control and interface functions in automation systems where industrial-grade temperature and reliable I/O matter.
• Embedded Systems — On-board protocol bridging, custom logic and data handling that benefit from high logic density and on-chip RAM.
• High-Density I/O Systems — Board designs requiring many external interfaces can leverage the 396 I/O pins to minimize external expansion.
• Prototyping and Development — Platform and system evaluation where a compact, high-pin-count, high-logic FPGA is required for proof-of-concept designs.

Unique Advantages

• High Logic Density: Approximately 147,443 logic elements allow consolidation of complex functions into a single device, reducing component count.
• Significant On-Chip Memory: Nearly 4.94 Mbits of embedded RAM helps lower external memory needs and simplifies board layout.
• Extensive I/O: 396 I/O pins provide flexibility to connect multiple peripherals and interfaces without external expanders.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to support deployments in harsher operating environments.
• Compact High-Pin Package: 676-FBGA (27×27) supplies a high pin count in a compact surface-mount footprint suitable for dense PCB designs.
• RoHS Compliant: Conforms to lead-free assembly practices for regulatory and manufacturing consistency.

Why Choose XC6SLX150T-2FGG676I?

The XC6SLX150T-2FGG676I positions itself as a high-capacity, industrial-grade Spartan®-6 LXT FPGA suited to designs that require a combination of large logic resources, embedded memory and broad I/O in a compact BGA package. Its specified operating temperature range and RoHS compliance make it appropriate for robust, long-lived products.

Engineers and procurement teams looking to consolidate functionality, reduce board-level complexity and support demanding environmental conditions will find this device a pragmatic option for mid- to high-density programmable logic implementations.

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